TDN1105W-23-RR

Recommended

soldering pad

Recommended

solder printing area

Soldering condition

6.

When using adhesive material for tentative fixatives, thermosetting resin or Ultraviolet radiation (UV)

setting resin with heat shall be recommended.

《The curing condition, Temperature:150℃Max./Time:120sec.Max.》

7.

Flow soldering (dip soldering) is not recommended for this product.

8. Isopropyl alcohol is recommended for cleaning. Some chemicals, including Freon substitute detergent

could corrode the lens or the casing surface, which cause discoloration, cloud, crack and so on.

Please review the reference chart below for cleaning.

If water is used to clean (including the final cleaning process), please use pure water (not tap water),

and completely dry the component before using.

Cleaning with ultrasonic is not recommended.

【Recommended Manual Soldering Condition】

Temperature of Iron Tip

350℃MAX.

Soldering Duration, Time

3sec.Max.,1 time

Chemical

Adaptability

Isopropyl Alcohol

○

Trichloroethylene

×

Chlorothene

×

Acetone

×

Thinner

×

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【 Precaution for mounting 】

A reasonable amount of solder should be put on each solder pad to prevent the LED from shifting position

during soldering. (Please see below diagram) Especially use caution to prevent solder from entering the LED,

for the best performance of the LED.

※ The proper solder paste thickness applied by the stencil printing method is 200 to 300μm

and by the dispenser method 2 to 3mg / spot. However, the dispenser method is inferior to the stencil

printing method concerning the supplied amount and the supplied alignment.

Therefore, the dispenser method is not recommended.

9.

When mounting, the pressure adjustment

of the nozzle for pick up should not bend the LED.

Load : Less than 4.9N

(to avoid the product breaking)

2014.11.11