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IS1870SF Datasheet(PDF) 1 Page - Microchip Technology

Part # IS1870SF
Description  Bluetooth짰 Low Energy (BLE) SoC
Download  44 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

IS1870SF Datasheet(HTML) 1 Page - Microchip Technology

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 2015-2016 Microchip Technology Inc.
DS60001371C-Page 1
IS1870/71
Features
• Bluetooth smart 4.2 Bluetooth Low-Energy (BLE)
compliant
• 256 Kbytes embedded Flash memory
• UART/SPI/I2C interface supported
• Integrated crystal oscillator, operates with 32 MHz
external crystal
• Temperature sensor supported
• Flexible GPIO pins:
- 31 GPIO pins (IS1870)
- 15 GPIO pins (IS1871)
• PWM support:
- 4-channel PWM support (IS1870)
- 1-channel PWM support (IS1871)
• 12 bits ADC (ENOB=10/8-bit) support for battery
and voltage detection. 16-channel (IS1870)/
6-channel (IS1871)
• AES-CMAC hardware engine
• Beacon support
• Low-power consumption
• Peak current: Tx 13 mA, Rx 13 mA at VBAT=3.0V,
buck power
• Compact size:
- IS1871: 4 mm x 4 mm 32QFN package
- IS1870: 6 mm x 6 mm 48QFN package
Radio Frequency (RF)/Analog Features
• ISM band: 2.402 GHz to 2.480 GHz operation
• Channels: 0-39
• Rx sensitivity: -90 dBm in BLE mode
• Tx power: +2 dBm (max)
• Received Signal Strength Indicator (RSSI) moni-
tor
Operating Conditions
• Operating voltage: 1.9V to 3.6V
• Operating temperature: -20°C to +70°C
Applications
• Internet of Things (IoT)
• Wearable, fitness, or healthcare
• Weight scale
• Proximity/Find Me services
• Payment/Security
• Digital Beacons
• Consumer appliances or home automation
• Industrial
Packages
Type
IS1870
IS1871
Pin Count
48
32
I/O Pins (up to)
31
16
Contact/Lead Pitch
0.4
0.4
Dimensions
6x6x0.9
4x4x0.9
Package
QFN48
QFN32
Note:
All dimensions are in millimeters (mm) unless specified.
Bluetooth® Low Energy (BLE) SoC
IS1870SF_IS1871SF.book Page 1 Thursday, March 31, 2016 10:29 AM


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