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TLV316-Q1, TLV2316-Q1, TLV4316-Q1

SBOS845A – NOVEMBER 2016 – REVISED DECEMBER 2016

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Product Folder Links: TLV316-Q1 TLV2316-Q1 TLV4316-Q1

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Copyright © 2016, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 3

6

Specifications......................................................... 6

6.1

Absolute Maximum Ratings ...................................... 6

6.2

ESD Ratings ............................................................ 6

6.3

Recommended Operating Conditions ....................... 6

6.4

Thermal Information: TLV316-Q1 ............................. 7

6.5

Thermal Information: TLV2316-Q1 ........................... 7

6.6

Thermal Information: TLV4316-Q1 ........................... 7

6.7

Electrical Characteristics........................................... 8

6.8

Typical Characteristics: Table of Graphs .................. 9

6.9

Typical Characteristics ............................................ 10

7

Detailed Description ............................................ 13

7.1

Overview ................................................................. 13

7.2

Functional Block Diagram ....................................... 13

7.3

Feature Description................................................. 14

7.4

Device Functional Modes........................................ 15

8

Application and Implementation ........................ 16

8.1

Application Information............................................ 16

8.2

System Examples ................................................... 16

9

Power Supply Recommendations ...................... 17

9.1

Input and ESD Protection ....................................... 17

10

Layout................................................................... 18

10.1

Layout Guidelines ................................................. 18

10.2

Layout Example .................................................... 18

11

Device and Documentation Support ................. 19

11.1

Documentation Support ........................................ 19

11.2

Related Links ........................................................ 19

11.3

Community Resources.......................................... 19

11.4

Trademarks ........................................................... 19

11.5

Electrostatic Discharge Caution ............................ 20

11.6

Glossary ................................................................ 20

12

Mechanical, Packaging, and Orderable

Information ........................................................... 20

4 Revision History

Changes from Original (November 2016) to Revision A

Page

•

Changed the CDM ESD Classification Level from C6 to C5 in the Features section ............................................................ 1

•

Deleted the SC70 (5), SOIC (8), and SOIC (14) packages from the Device Information table ............................................ 1

•

Deleted the DCK (SC70) package from the TLV316-Q1 pinout diagram in the Pin Configurations and Functions

section ................................................................................................................................................................................... 3

•

Deleted the DCK (SC70) pinout information from the Pin Functions: TLV316-Q1 table in the Pin Configurations and

Functions section ................................................................................................................................................................... 3

•

Deleted D (SOIC) package from the TLV2316-Q1 pinout diagram in the Pin Configurations and Functions section .......... 4

•

Deleted the D (SOIC) package from TLV4316-Q1 pinout diagram in the Pin Configurations and Functions section ........... 5

•

Changed the ESD Ratings table from commercial to automotive specifications .................................................................. 6

•

Changed the CDM ESD rating from ±1500 to ±750 in the ESD Ratings table ..................................................................... 6

•

Deleted the DCK (SC70) package from the Thermal Information: TLV316-Q1 table in the Specifications section............... 7

•

Changed the formatting of all Thermal Information table notes ............................................................................................ 7

•

Deleted the D (SOIC) package from the Thermal Information: TLV2316-Q1 table in the Specifications section.................. 7

•

Deleted the D (SOIC) package from the Thermal Information: TLV4316-Q1 table in the Specifications section ................. 7

•

Deleted the static literature number in the SBOA128 application note reference in the EMI Susceptibility and Input

Filtering section..................................................................................................................................................................... 15

•

Deleted the static literature number in document reference in the Layout Guidelines section ........................................... 18

•

Changed the layout example image (Figure 41) in Layout Example section ....................................................................... 18

•

Deleted the static literature numbers from document references in Related Documentation section ................................ 19