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TPS3813J25, TPS3813L30, TPS3813K33, TPS3813I50

www.ti.com

SLVS331H – DECEMBER 2000 – REVISED JULY 2016

Product Folder Links: TPS3813J25 TPS3813L30 TPS3813K33 TPS3813I50

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Copyright © 2000–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to GND. For reliable operation, the device must not be operated at 7 V for more than t = 1000h

continuously.

7 Specifications

7.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted).

(1)

MIN

MAX

UNIT

7

V

RESET

–0.3

V

–0.3

7

V

Maximum low output current

5

mA

Maximum high output current

–5

mA

±20

mA

±20

mA

Continuous total power dissipation

See Dissipation Ratings

Soldering temperature

260

°C

Operating free-air temperature

–40

85

°C

Storage temperature

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±4000

V

±1500

7.3 Recommended Operating Conditions

At specified temperature range.

MIN

MAX

UNIT

Supply voltage

2

6

V

Input voltage

0

V

High-level input voltage

V

Low-level input voltage

V

Δt/ΔV

Input transition rise and fall rate

100

ns/V

Pulse width of WDI trigger pulse

50

ns

Operating free-air temperature

–40

85

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

TPS3813xxx

UNIT

DBV (SOT-23)

6 PINS

Junction-to-ambient thermal resistance

208.5

°C/W

Junction-to-case (top) thermal resistance

123.3

°C/W

Junction-to-board thermal resistance

37.2

°C/W

Junction-to-top characterization parameter

14.6

°C/W

Junction-to-board characterization parameter

36.3

°C/W

Junction-to-case (bottom) thermal resistance

n/a

°C/W