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TPS3813J25 Datasheet(PDF) 5 Page - Texas Instruments |
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TPS3813J25 Datasheet(HTML) 5 Page - Texas Instruments |
5 / 24 page 5 TPS3813J25, TPS3813L30, TPS3813K33, TPS3813I50 www.ti.com SLVS331H – DECEMBER 2000 – REVISED JULY 2016 Product Folder Links: TPS3813J25 TPS3813L30 TPS3813K33 TPS3813I50 Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to GND. For reliable operation, the device must not be operated at 7 V for more than t = 1000h continuously. 7 Specifications 7.1 Absolute Maximum Ratings Over operating free-air temperature range (unless otherwise noted). (1) MIN MAX UNIT VDD Supply voltage(2) 7 V RESET –0.3 VDD + 0.3 V All other pins (2) –0.3 7 V IOL Maximum low output current 5 mA IOH Maximum high output current –5 mA IIK Input clamp current (VI < 0 or VI > VDD) ±20 mA IOK Output clamp current (VO < 0 or VO > VDD) ±20 mA Continuous total power dissipation See Dissipation Ratings Soldering temperature 260 °C TA Operating free-air temperature –40 85 °C Tstg Storage temperature –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1500 7.3 Recommended Operating Conditions At specified temperature range. MIN MAX UNIT VDD Supply voltage 2 6 V VI Input voltage 0 VDD + 0.3 V VIH High-level input voltage 0.7 × VDD V VIL Low-level input voltage 0.3 × VDD V Δt/ΔV Input transition rise and fall rate 100 ns/V tw Pulse width of WDI trigger pulse 50 ns TA Operating free-air temperature –40 85 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.4 Thermal Information THERMAL METRIC(1) TPS3813xxx UNIT DBV (SOT-23) 6 PINS RθJA Junction-to-ambient thermal resistance 208.5 °C/W RθJC(top) Junction-to-case (top) thermal resistance 123.3 °C/W RθJB Junction-to-board thermal resistance 37.2 °C/W ψJT Junction-to-top characterization parameter 14.6 °C/W ψJB Junction-to-board characterization parameter 36.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W |
Similar Part No. - TPS3813J25_16 |
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Similar Description - TPS3813J25_16 |
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