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TPS3805H33 Datasheet(PDF) 4 Page - Texas Instruments |
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TPS3805H33 Datasheet(HTML) 4 Page - Texas Instruments |
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4 / 25 page  TPS3803-01-Q1 TPS3803G15-Q1, TPS3805H33-Q1 SGLS228C – DECEMBER 2003 – REVISED SEPTEMBER 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VDD Supply voltage(2) 7 7 V Voltage applied to all other pins(2) –0.3 7 V IOL Maximum low-level output current 5 mA IOH Maximum high-level output current –5 mA IIK Input clamp current VI < 0 or VI > VDD ±10 mA IOK Output clamp current VO < 0 or VO > VDD ±10 mA PD Continuous total power dissipation See Dissipation Ratings TA Operating free-air temperature –40 125 °C Tsolder Soldering temperature 260 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to GND. For reliable operation, the device should not be continuously operated at 7 V for more than t = 1000 h. 7.2 ESD Ratings VALUE UNIT Human body model (HBM), per AEC Q100-002(1) ±2000 Electrostatic V(ESD) V discharge Charged-device model (CDM), per AEC Q100-011 ±1000 (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 7.3 Recommended Operating Conditions MIN MAX UNIT VDD Supply voltage 1.3 6 V VI Input voltage 0 VDD + 0.3 V TA Operating free-air temperature –40 125 °C 7.4 Thermal Information TPS3803x-Q1 TPS3805x-Q1 THERMAL METRIC(1) UNIT DCK (SC-70) 5 PINS RθJA Junction-to-ambient thermal resistance 246.6 °C/W RθJC(top) Junction-to-case (top) thermal resistance 68.2 °C/W RθJB Junction-to-board thermal resistance 78.4 °C/W ψJT Junction-to-top characterization parameter 0.9 °C/W ψJB Junction-to-board characterization parameter 77.7 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2003–2015, Texas Instruments Incorporated Product Folder Links: TPS3803-01-Q1 TPS3803G15-Q1 TPS3805H33-Q1 |
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