PG. 7

8. SOLDERING AND MOUNTING :

Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that

a) Preheat circuit and products to 150°C.

b) 355°C tip temperature (max)

c) Never contact the ceramic with the iron tip

a soldering iron must be employed the following precautions are recommended.

Reflow times: 3 times Max.

Time(sec.)

60~150s

20~40s

Soldering

4 80s max.

60~180s

150

25

TP(260°C/40s max.)

217

200

Preheating

Note :

G rad ual

Cooling

cooling

Natural

O ver 60s

Iron Soldering times: 1 times Max.

Preheating

350

150

w ithin 4-5s

Soldering

e) Use a 20 watt soldering iron with tip diameter of 1.0mm

f) Limit soldering time to 4-5 secs.

d) 1.0mm tip diameter (max)

cooling

Natural

8-1. Recommended PC Board Pattern

9-2.2 Soldering Iron (Figure 2) :

9-2.1 Lead Free Solder Re-flow :

wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot

by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all

Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused

Recommended temperature profiles for re-flow soldering in Figure 1.

air soldering tools.

9-2. Soldering

2.7

0.8

Time(sec.)

SUPERWORLD ELECTRONICS (S) PTE LTD

15.08.2013

NOTE : Specifications subject to change without notice. Please check our website for latest information.

SMD POWER INDUCTOR

Fig.1

Fig.2

SPS252012H SERIES