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MTBH0N25L3-0-T3-G Datasheet(PDF) 5 Page - Cystech Electonics Corp. |
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MTBH0N25L3-0-T3-G Datasheet(HTML) 5 Page - Cystech Electonics Corp. |
5 / 9 page CYStech Electronics Corp. Spec. No. : C895L3 Issued Date : 2016.11.26 Revised Date : Page No. : 5/9 MTBH0N25L3 Preliminary CYStek Product Specification Typical Characteristics(Cont.) Capacitance vs Drain-to-Source Voltage 10 100 1000 0 10 2030 405060 7080 90 100 VDS, Drain-Source Voltage(V) C oss Ciss Crss Threshold Voltage vs Junction Tempearture 0.5 0.7 0.9 1.1 1.3 1.5 -75 -50 -25 0 25 50 75 100 125 150 175 Tj, Junction Temperature(°C) ID=250μA ID=1mA Forward Transfer Admittance vs Drain Current 0.01 0.1 1 10 0.001 0.01 0.1 1 10 ID, Drain Current(A) Pulsed Ta=25°C VDS=15V VDS=10V Gate Charge Characteristics 0 2 4 6 8 10 02 4 6 8 10 12 14 Qg, Total Gate Charge(nC) VDS=125V VDS=200V ID=1A Maximum Safe Operating Area 0.001 0.01 0.1 1 10 0.1 1 10 100 1000 VDS, Drain-Source Voltage(V) RDS(ON) Limited DC 10ms 100ms 1ms 100 μs 10 μs TA=25°C, Tj=150°C, RθJA=50°C/W, Single Pulse Maximum Drain Current vs Junction Temperature 0 0.2 0.4 0.6 0.8 1 1.2 1.4 25 50 75 100 125 150 175 Tj, Junction Temperature(°C) VGS=10V, RθJA=50°C/W |
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