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ADS7029-Q1

SBAS811 – JANUARY 2017

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Copyright © 2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

(1)

MIN

MAX

UNIT

AVDD to GND

–0.3

3.9

V

DVDD to GND

–0.3

3.9

V

AINP to GND

–0.3

AVDD + 0.3

V

AINM to GND

–0.3

0.3

V

Digital input voltage to GND

–0.3

DVDD + 0.3

V

–60

150

°C

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

Charged-device model (CDM), per AEC Q100-011

±1000

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

AVDD

Analog supply voltage range

2.35

3.6

V

DVDD

Digital supply voltage range

1.65

3.6

V

Operating free-air temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

ADS7029-Q1

UNIT

DCU (VSSOP)

8 PINS

Junction-to-ambient thermal resistance

181.8

°C/W

Junction-to-case (top) thermal resistance

50.8

°C/W

Junction-to-board thermal resistance

73.9

°C/W

Junction-to-top characterization parameter

1.0

°C/W

Junction-to-board characterization parameter

73.9

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W