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AD9694BCPZRL7-500 Datasheet(PDF) 11 Page - Analog Devices |
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AD9694BCPZRL7-500 Datasheet(HTML) 11 Page - Analog Devices |
11 / 101 page Data Sheet AD9694 Rev. 0 | Page 11 of 101 ABSOLUTE MAXIMUM RATINGS Table 8. Parameter Rating Electrical AVDD1 to AGND 1.05 V AVDD1_SR to AGND 1.05 V AVDD2 to AGND 2.00 V AVDD3 to AGND 2.70 V DVDD to DGND 1.05 V DRVDD1 to DRGND 1.05 V DRVDD2 to DRGND 2.00 V SPIVDD to AGND 2.00 V VIN±x to AGND −0.3 V to AVDD3 + 0.3 V CLK± to AGND −0.3 V to AVDD1 + 0.3 V SCLK, SDIO, CSB to DGND −0.3 V to SPIVDD + 0.3 V PDWN/STBY to DGND −0.3 V to SPIVDD + 0.3 V SYSREF± to AGND_SR 0 V to 2.5 V SYNCINB±AB/SYNCINB±CD to DRGND 0 V to 2.5 V Environmental Operating Junction Temperature Range −40°C to +105°C Maximum Junction Temperature 125°C Storage Temperature Range (Ambient) −65°C to +150°C Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. THERMAL RESISTANCE Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Careful attention to PCB thermal design is required. θJA is the natural convection junction to ambient thermal resistance measured in a one cubic foot sealed enclosure. θJC_BOT is the bottom junction to case thermal resistance. Table 9. Thermal Resistance PCB Type Airflow Velocity (m/sec) θJA θJC_BOT Unit JEDEC 2s2p Board 0.0 21.581, 2 1.951, 5 °C/W 1.0 17.941, 2 N/A4 °C/W 2.5 16.581, 2 N/A4 °C/W 10-Layer Board 0.0 9.74 1.00 °C/W 1 Per JEDEC 51-7, plus JEDEC 51-5 2s2p test board. 2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air). 3 Per JEDEC JESD51-8 (still air). 4 N/A means not applicable. 5 Per MIL-STD 883, Method 1012.1. ESD CAUTION |
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