1.70±0.10 (x4)

non plated mounting hole

0.85±0.025 (x2)

non plated alignment hole

29.725±0.050

5.08±0.025

2.54±0.025

2.7975

0.635 pad

1.27 typ.

1.25±0.125

1.25±0.125

32.225

32.60

24.13

24.13

3.1725*

1.27 typ.

29.725±0.05

11.69

12.065

34.725

Insulation plate outline

33.625

Socket Outline

33.625

Socket Ouline

A1 orientation mark

Target PCB Recommendations

Total thickness: 1.6mm min.

Plating: Gold or Solder finish

PCB Pad height: Same or higher than solder mask

*Note: BGA pattern is not symmetrical

with respect to the mounting holes.

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance

±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change

without notice.

Description: Recommended Layout

Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.

STATUS: Released

REV. A

DATE: 3/26/2015

Material: Material <not specified>

Finish:

Weight: 53.01

SBT-BGA-6037 Drawing

SCALE: 3:1

SHEET: 2 OF 4

ENG: S. Faiz

FILE: SBT-BGA-6037 Dwg

DRAWN BY: M. Raske