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HSDL-9000 Datasheet(PDF) 7 Page - Agilent(Hewlett-Packard) |
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HSDL-9000 Datasheet(HTML) 7 Page - Agilent(Hewlett-Packard) |
7 / 14 page 7 Moisture Proof Packaging All HSDL-9000 options are shipped in moisture proof package. Once opened, moisture absorption begins. This part is compliant to JEDEC Level 2a. Baking Conditions If the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the parts. Package Temp. Time In reels 60 °C 20 hours In bulk 125 °C 5 hours Baking should only be done once. Recommended Storage Conditions Storage Temperature 10 °C to 30°C Relative Humidity below 60% RH Time from Unsealing to Soldering After removal from the bag, the parts should be soldered within twenty-eight days if stored at the recommended storage conditions. If times longer than 28 days are needed, the parts must be stored in a dry box. Figure 5. Baking conditions chart. UNITS IN A SEALED MOISTURE-PROOF PACKAGE PACKAGE IS OPENED (UNSEALED) ENVIRONMENT LESS THAN 30°C, AND LESS THAN 60% RH PACKAGE IS OPENED LESS THAN 672 HOURS (4 WEEKS) PERFORM RECOMMENDED BAKING CONDITIONS NO BAKING IS NECESSARY YES NO NO YES |
Similar Part No. - HSDL-9000 |
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Similar Description - HSDL-9000 |
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