HSDL-9000 datasheet(7/14 Pages) HP

Part #	HSDL-9000

Description	Miniature Surface-Mount Ambient Light Photo Sensor

Download	14 Pages

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Manufacturer	HP [Agilent(Hewlett-Packard)]

Direct Link	http://www.home.agilent.com

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7 / 14 page

7

Moisture Proof Packaging

All HSDL-9000 options are

shipped in moisture proof

package. Once opened, moisture

absorption begins.

This part is compliant to JEDEC

Level 2a.

Baking Conditions

If the parts are not stored in dry

conditions, they must be baked

before reflow to prevent damage

to the parts.

Package

Temp.

Time

In reels

60

°C

20 hours

In bulk

125

°C

5 hours

Baking should only be done once.

Recommended Storage Conditions

Storage Temperature

10

°C to 30°C

Relative Humidity

below

60% RH

Time from Unsealing to Soldering

After removal from the bag, the

parts should be soldered within

twenty-eight days if stored at the

recommended storage conditions.

If times longer than 28 days are

needed, the parts must be stored

in a dry box.

Figure 5. Baking conditions chart.

UNITS IN A SEALED

MOISTURE-PROOF

PACKAGE

PACKAGE IS

OPENED (UNSEALED)

ENVIRONMENT

LESS THAN 30°C,

AND LESS THAN

60% RH

PACKAGE IS

OPENED LESS

THAN 672 HOURS

(4 WEEKS)

PERFORM RECOMMENDED

BAKING CONDITIONS

NO BAKING

IS NECESSARY

YES

NO

YES

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HSDL-9000 Datasheet(PDF) 7 Page - Agilent(Hewlett-Packard)

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