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71T75802150BGGI Datasheet(PDF) 2 Page - Integrated Device Technology

Part # 71T75802150BGGI
Description  Synchronous ZBT SRAMs
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Manufacturer  IDT [Integrated Device Technology]
Direct Link  http://www.idt.com
Logo IDT - Integrated Device Technology

71T75802150BGGI Datasheet(HTML) 2 Page - Integrated Device Technology

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IDT71T75602, IDT71T75802, 512K x 36, 1M x 18, 2.5V Synchronous ZBT™ SRAMs with
2.5V I/O, Burst Counter, and Pipelined Outputs
Commercial and Industrial Temperature Ranges
Pin Definitions(1)
NOTE:
1. All synchronous inputs must meet specified setup and hold times with respect to CLK.
Symbol
Pin Function
I/O
Active
Description
A0-A19
Address Inputs
I
N/A
Synchronous Address inputs. The address register is triggered by a combination of the rising edge of CLK,
ADV/LD low, CEN low, and true chip enables.
ADV/LD
Advance / Load
I
N/A
ADV/LD is a synchronous input that is used to load the internal registers with new address and control when it is
sampled lo w at the rising edge of clock with the chip selected. When ADV/LD is low with the chip deselected,
any burst in progress is terminated. When ADV/LD is sampled high then the internal burst counter is advanced
for any burst that was in progress. The external addresses are ignored when ADV/LD is sampled high.
R/W
Read / Write
I
N/A
R/W signal is a synchronous input that identifies whether the current load cycle initiated is a Read or Write access
to the memory array. The data bus activity for the current cycle takes place two clock cycles later.
CEN
Clock Enable
I
LOW
Synchronous Clock Enable Input. When CEN is sampled high, all other synchronous inputs, including clock are
ignored and outputs remain unchanged. The effect of CEN sampled high on the device outputs is as if the low
to high clock transition did not occur. For normal operation, CEN must be sampled low at rising edge of clock.
BW1
-BW4
Individual Byte
Write Enables
I
LOW
Synchronous byte write enables. Each 9-bit byte has its own active low byte write enable. On load write cycles
(when R/W and ADV/LD are sampled low) the appropriate byte write signal (BW1-BW4) must be valid. The byte
write signal must also be valid on each cycle of a burst write. Byte Write signals are ignored when R/W is sampled
high. The appropriate byte(s) of data are written into the device two cycles later. BW1-BW4 can all be tied low if
always doing write to the entire 36-bit word.
CE1
, CE2
Chip Enables
I
LOW
Synchronous active low chip enable. CE1 and CE2 are used with CE2 to enable the IDT71T75602/802 (CE1 or CE2
sampled high or CE2 sampled low) and ADV/LD low at the rising edge of clock, initiates a deselect cycle. The
ZBTTM has a two cycle deselect, i.e., the data bus will tri-state two clock cycles after deselect is initiated.
CE2
Chip Enable
I
HIGH
Synchronous active high chip enable. CE2 is used with CE1 and CE2 to enable the chip. CE2 has inverted polarity
but otherwise identical to CE1 and CE2.
CLK
Clock
I
N/A
This is the clock input to the IDT71T75602/802. Except for OE, all timing references for the device are made with
respect to the rising edge of CLK.
I/O0-I/O31
I/OP1-I/OP4
Data Input/Output
I/O
N/A
Synchronous data input/output (I/O) pins. Both the data input path and data output path are registered and triggered
by the rising edge of CLK.
LBO
Linear Burst Order
I
LOW
Burst order selection input. When LBO is high the Interleaved burst sequence is selected. When LBO is low the
Linear burst sequence is selected. LBO is a static input and it must not change during device operation.
OE
Output Enable
I
LOW
Asynchronous output enable. OE must be low to read data from the 71T75602/802. When OE is high the I/O pins
are in a high-impedance state.OE does not need to be actively controlled for read and write cycles. In normal
operation, OE can be tied low.
TMS
Test Mode Select
I
N/A
Gives input command for TAP controller. Sampled on rising edge of TDK. This pin has an internal pullup.
TDI
Test Data Input
I
N/A
Serial input of registers placed between TDI and TDO. Sampled on rising edge of TCK. This pin has an internal
pullup.
TCK
Test Clock
I
N/A
Clock input of TAP controller. Each TAP event is clocked. Test inputs are captured on rising edge of TCK, while
test outputs are d riven from the falling edge of TCK. This pin has an internal pullup.
TDO
Test Data Output
O
N/A
Serial output of registers placed between TDI and TDO. This output is active depending on the state of the TAP
controller.
TRST
JTAG Reset
(Optional)
ILOW
Optional asynchronous JTAG reset. Can be used to reset the TAP controller, but not required. JTAG reset occurs
automatically at power up and also resets using TMS and TCK per IEEE 1149.1. If not used TRST can be left
floating. This pin has an internal pullup. Only available in BGA package.
ZZ
Sleep Mode
I
HIGH
Synchronous sleep mode input. ZZ HIGH will gate the CLK internally and power down the IDT71T75602/802 to its
lowest power consumption level. Data retention is guaranteed in Sleep Mode. This pin has an internal pulldown.
VDD
Power Supply
N/A
N/A
2.5V core power supply.
VDDQ
Power Supply
N/A
N/A
2.5V I/O Supply.
VSS
Ground
N/A
N/A
Ground.
5313 tbl 02
Description (cont.)
Thedatabuswilltri-statetwocyclesafterthechipisdeselectedorawrite
isinitiated.
The IDT71T75602/802 have an on-chip burst counter. In the burst
mode, the IDT71T75602/802 can provide four cycles of data for a
single address presented to the SRAM. The order of the burst
sequence is defined by the LBO input pin. The LBO pin selects
between linear and interleaved burst sequence. The ADV/LD signal is
used to load a new external address (ADV/LD = LOW) or increment
the internal burst counter (ADV/LD = HIGH).
The IDT71T75602/802 SRAMs utilize a high-performance 2.5V
CMOSprocess,andarepackagedinaJEDECStandard14mmx20mm
100pin thin plastic quad flatpack (TQFP) as well as a 119 ball grid array
(BGA).


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