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G771 Datasheet(PDF) 4 Page - Global Mixed-mode Technology Inc |
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G771 Datasheet(HTML) 4 Page - Global Mixed-mode Technology Inc |
4 / 15 page Ver 0.2 Preliminary Dec 11, 2001 TEL: 886-3-5788833 http://www.gmt.com.tw 4 G771 Global Mixed-mode Technology Inc. Electrical Characteristics (continued) (VCC =full range, TA= 60°C, unless otherwise noted.) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Reset Threshold VTH 4.2 4.4 4.5 V Reset Active Timeout Period 340 ms Output Voltage Low VOL VCC=VTH min ISINK =3.2mA 0.4 V RESET Output Voltage High VOH VCC>VTH max, ISOURCE =5.0mA VCC-1.5 V Note 1: Guaranteed but not 100% tested. Note 2: Quantization error is not included in specifications for temperature accuracy. For example, if the G771 device temperature is exactly +66.7°C, or +68°C (due to the quantization error plus the +1/2°C offset used for rounding up) and still be within the guaranteed ±3°C error limits for the +60°C to +100°C tem- perature range. See Table3. Note 3: A remote diode is any diode-connected transistor from Table1. TR is the junction temperature of the re- mote diode. See Remote Diode Selection for remote diode forward voltage requirements. Note 4: The SMBus logic block is a static design that works with clock frequencies down to DC. While slow op- eration is possible, it violates the 10kHz minimum clock frequency and SMBus specifications, and may monopolize the bus. Note 5: Note that a transition must internally provide at least a hold time in order to bridge the undefined region (300ns max) of SMBCLK's falling edge. Pin Description PIN NAME FUNCTION 1,6,10,13,15 NC Not connected. 2 Vcc Supply Voltage Input, 4.5V to 5.5V. Bypass to GND with a 0.1µF capacitor. 3 DXP1 Combined Current Source and A/D Positive Input for remote-diode channel 1. Do not leave DXP1 floating; tie DXP1 to DXN if no remote diode on channel 1 is used. Place a 2200pF capacitor be- tween DXP1 and DXN for noise filtering. 4 DXN Combined Current Sink and A/D Negative Input. DXN is common negative node of both remote di- odes on channel 1 and 2. The traces of DXP1-DXN and DXP2-DXN pairs should be routed inde- pendently. The common DXN should be connected together as close as possible to the IC. DXN is internally connected to the GND pin for signal ground use. 5 DXP2 Combined Current Source and A/D Positive Input for remote-diode channel 2. Do not leave DXP2 floating; tie DXP2 to DXN if no remote diode on channel 2 is used. Place a 2200pF capacitor be- tween DXP2 and DXN for noise filtering. 7 DGND Digital Ground. 8 AGND Analog Ground. 9 RESET RESET Output remains low while VCC is below the reset threshold, and for 240ms after VCC rises above the reset threshold. 11 ALERT SMBus Alert (interrupt) Output, open drain. 12 SMBDATA SMBus Serial-Data Input / Output, open drain. 14 SMBCLK SMBus Serial-Clock Input. 16 TH_SHUT Thermal Shutdown Output, push-pull output. |
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