Reflow Profile

Profile Feature

Pb-Free Assembly

Average Ramp-Up Rate (Tsmax to Tp)

3 °C/sec. max.

Preheat

- Temperature Min. (Tsmin)

- Temperature Max. (Tsmax)

- Time (tsmin to tsmax)

150 °C

200 °C

60-180 sec.

Time maintained above:

- Temperature (TL)

- Time (tL)

217 °C

60-150 sec.

Peak/Classification Temperature (Tp)

260 °C

Time within 5 °C of Actual Peak Temp. (tp)

20-40 sec.

Ramp-Down Rate

6 °C/sec. max.

Time 25 °C to Peak Temperature

8 min. max.

Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

Performance Graphs (Continued)

Power Derating Curve

Typical Resistance vs. Temperature

No additional PCB Cu

0.5 sq. in. additional PCB CU

Junction Temperature (°C)

20

3.0

2.5

2.0

1.5

1.0

0.5

0.0

40

60

80

100

120

140

2.2

1.6

1.8

2.0

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

-75 -50 -25

0

25

50

75 100 125 150

Junction Temperature (°C)