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TBU-KExxx-100-WH Datasheet(PDF) 4 Page - Bourns Electronic Solutions |
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TBU-KExxx-100-WH Datasheet(HTML) 4 Page - Bourns Electronic Solutions |
4 / 6 page Reflow Profile Profile Feature Pb-Free Assembly Average Ramp-Up Rate (Tsmax to Tp) 3 °C/sec. max. Preheat - Temperature Min. (Tsmin) - Temperature Max. (Tsmax) - Time (tsmin to tsmax) 150 °C 200 °C 60-180 sec. Time maintained above: - Temperature (TL) - Time (tL) 217 °C 60-150 sec. Peak/Classification Temperature (Tp) 260 °C Time within 5 °C of Actual Peak Temp. (tp) 20-40 sec. Ramp-Down Rate 6 °C/sec. max. Time 25 °C to Peak Temperature 8 min. max. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TBU-KE Series - TBU® High Speed Protectors Performance Graphs (Continued) Power Derating Curve Typical Resistance vs. Temperature No additional PCB Cu 0.5 sq. in. additional PCB CU Junction Temperature (°C) 20 3.0 2.5 2.0 1.5 1.0 0.5 0.0 40 60 80 100 120 140 2.2 1.6 1.8 2.0 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -75 -50 -25 0 25 50 75 100 125 150 Junction Temperature (°C) |
Similar Part No. - TBU-KExxx-100-WH |
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Similar Description - TBU-KExxx-100-WH |
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