2.540

5.080

17.725

Backing Plate Outline

15.225

Socket base outline

1.700±0.100 (x4)

non-plated mounting hole

0.850±0.025 (x2)

non-plated alignment hole

3.6125±0.025*

3.3625

0.500 typ

0.280 (x169) pad

12.725±0.050 (x2)

6.000

*Note: BGA pattern is not symmetrical

with respect to the mounting holes.

It is shifted by 0.25mm to the right of center

with respect to the mounting holes

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all

other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.

Description: Recommended PCB Layout

Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.

STATUS: Released

REV. A

DATE: 08/19/2014

Material: N/A

Finish: N/A

Weight: 10.18

SBT-BGA-7021 Drawing

SCALE: 6:1

SHEET: 2 OF 4

ENG: M.A. Fedde

FILE: SBT-BGA-7021 Dwg

DRAWN BY: M. Raske