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P83C280 Datasheet(PDF) 2 Page - NXP Semiconductors |
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P83C280 Datasheet(HTML) 2 Page - NXP Semiconductors |
2 / 84 page 1997 Dec 12 2 Philips Semiconductors Product specification Microcontrollers for monitors with DDC interface, auto-sync detection and sync proc. P83Cx80; P87C380 CONTENTS 1 FEATURES 1.1 Differences from the 80C51 core 1.2 Memory 2 GENERAL DESCRIPTION 3 ORDERING INFORMATION 4 BLOCK DIAGRAM 5 PINNING INFORMATION 5.1 Pinning 5.2 Pin description 6 FUNCTIONAL DESCRIPTION 6.1 General 7 MEMORY ORGANIZATION 7.1 Program memory 7.2 Internal data memory 7.3 Additional Special Function Registers 8 INTERRUPTS 8.1 Priority level structure 8.2 How interrupts are handled 8.3 Interrupt Enable Register (IE) 8.4 Interrupt Priority Register (IP) 9 WATCHDOG TIMER 10 INPUT/OUTPUT (I/O) 10.1 The alternative functions for Port 0, Port 1, Port 2 and Port 3 10.2 EMI (Electromagnetic Interference) reduction 11 REDUCED POWER MODES 11.1 Power Control Register 11.2 Idle mode 11.3 Power-down mode 11.4 Status of external pins 12 OSCILLATOR 13 RESET 13.1 External reset 13.2 Power-on-reset 13.3 T2 (Watchdog Timer) overflow 14 ANALOG CONTROL (DC) 14.1 8-bit PWM outputs (PWM0 to PWM9) 14.2 14-bit PWM output (PWM10) 14.3 A typical PWM output application 15 ANALOG-TO-DIGITAL CONVERTER (ADC) 15.1 Conversion algorithm 16 DIGITAL-TO-ANALOG CONVERTER (DAC) 16.1 8-bit Data Registers for the DAC outputs (DACn; n = 0 to 3) 17 DISPLAY DATA CHANNEL (DDC) INTERFACE 17.1 Special Function Registers related to the DDC interface 17.2 Host type detection 17.3 DDC1 protocol 17.4 DDC2B protocol 17.5 DDC2AB/DDC2B+ protocol 17.6 RAM buffer for the system and DDC application 18 I2C-BUS INTERFACE 19 HARDWARE MODE DETECTION 19.1 Special Function Register for mode detection and sync separation 19.2 System description 19.3 System operation 20 POWER MANAGEMENT 21 CONTROL MODES 22 ONE TIME PROGRAMMABLE (OTP) VERSION 23 LIMITING VALUES 24 HANDLING 25 DC CHARACTERISTICS 26 DIGITAL-TO-ANALOG CONVERTER CHARACTERISTICS 27 AC CHARACTERISTICS 28 PACKAGE OUTLINE 29 SOLDERING 29.1 Introduction 29.2 Soldering by dipping or by wave 29.3 Repairing soldered joints 30 DEFINITIONS 31 LIFE SUPPORT APPLICATIONS 32 PURCHASE OF PHILIPS I2C COMPONENTS |
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