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BQ294708DSGR Datasheet(PDF) 5 Page - Texas Instruments |
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BQ294708DSGR Datasheet(HTML) 5 Page - Texas Instruments |
5 / 27 page 5 bq2947 www.ti.com SLUSB15F – SEPTEMBER 2012 – REVISED JANUARY 2017 Product Folder Links: bq2947 Submit Documentation Feedback Copyright © 2012–2017, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7 Specifications 7.1 Absolute Maximum Ratings Over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage VDD–VSS –0.3 30 V Input voltage V4–V3, V3–V2, V2–V1, V1–VSS, or CD–VSS –0.3 30 V Output voltage OUT–VSS –0.3 30 V Continuous total power dissipation, PTOT See Thermal Information Lead temperature (soldering, 10 s), TSOLDER 300 °C Storage temperature, Tstg –65 150 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±500 7.3 Recommended Operating Conditions Over-operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Supply voltage, VDD 3 20 V Input voltage range V4–V3, V3–V2, V2–V1, V1–VSS, or CD–VSS 0 5 V Operating ambient temperature range, TA –40 110 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.4 Thermal Information THERMAL METRIC(1) bq2947 UNIT WSON 8 PINS RθJA Junction-to-ambient thermal resistance 62 °C/W RθJC(top) Junction-to-case(top) thermal resistance 72 °C/W RθJB Junction-to-board thermal resistance 32.5 °C/W ψJT Junction-to-top characterization parameter 1.6 °C/W ψJB Junction-to-board characterization parameter 33 °C/W RθJC(bottom) Junction-to-case(bottom) thermal resistance 10 °C/W |
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