Electronic Components Datasheet Search |
|
AIC1735-33XU Datasheet(PDF) 9 Page - Analog Intergrations Corporation |
|
AIC1735-33XU Datasheet(HTML) 9 Page - Analog Intergrations Corporation |
9 / 12 page AIC1735 9 temperature suitable in application. As a general rule, the lower temperature is, the better reliability of the device is. So the PCB mounting pad should provide maximum thermal conductivity to maintain low device temperature. GND pin performs a dual function for providing an electrical connection to ground and channeling heat away. Therefore, connecting the GND pin to ground with a large pad or ground plane would increase the power dissipation and reduce the device temperature. PHYSICAL DIMENSIONS (unit: mm) SOT-23 0° 0.90 0.30 1.50 2.60 2.80 0.08 0.30 0.05 e θ L1 L e1 c E E1 D b A2 A1 0.95 BSC 8° 0.60 1.90 BSC 0.60 REF 1.30 1.70 3.00 3.00 0.22 0.50 0.15 0.95 MIN. S Y M B O L A 1.45 MAX. SOT-23 MILLIMETERS b WITH PLATING VIEW B L1 L SEATING PLANE GAUGE PLANE SECTION A-A BASE METAL e1 e D AA SEE VIEW B Note: 1.Refer to JEDEC MO-178. 2.Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side. 3.Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. |
Similar Part No. - AIC1735-33XU |
|
Similar Description - AIC1735-33XU |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.NET |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |