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AIC1730-28 Datasheet(PDF) 10 Page - Analog Intergrations Corporation |
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AIC1730-28 Datasheet(HTML) 10 Page - Analog Intergrations Corporation |
10 / 12 page AIC1730 10 APPLICATION INFORMATION INPUT-OUTPUT CAPACITORS Linear regulators require input and output capacitors to maintain stability. Input capacitor at 1 μF with 1uF aluminum electrolytic output capacitor is recommended. And it should be selected within the Equivalent Series Resistance (ESR) range as shown in the figure 21, 22, 23, and 24. ESR of ceramic capacitor is lower and its electrical characteristics (capacitance and ESR) vary widely over temperature. In general, tantalum or electric output capacitor is suggested for heavy load. Normally, the output capacitor should be 1 μF (aluminum electrolytic) at least and rates for operating temperature range. Note that it’s important to check selected manufactures electrical characteristics (capacitance and ESR) over temperature. NOISE BYPASS CAPACITOR 0.1 μF bypass capacitor at BP pin reduces output voltage noise. And the BP pin has to connect a capacitor to GND. POWER DISSIPATION The maximum power dissipation of AIC1742 depends on the thermal resistance of its case and circuit board, the temperature difference between the die junction and ambient air, and the rate of airflow. The rate of temperature rise is greatly affected by the mounting pad configuration on the PCB, the board material, and the ambient temperature. When the IC mounting with good thermal conductivity is used, the junction temperature will be low even when large power dissipation applies. The power dissipation across the device is P = IOUT (VIN-VOUT). The maximum power dissipation is: ) R θ (R θ ) T (T P BA JB A J MAX + − = Where TJ-TA is the temperature difference between the die junction and the surrounding air, R θ JB is the thermal resistance of the package, and R θ BA is the thermal resistance through the PCB, copper traces, and other materials to the surrounding air. As a general rule, the lower temperature is, the better reliability of the device is. So the PCB mounting pad should provide maximum thermal conductivity to maintain low device temperature. GND pin performs a dual function of providing an electrical connection to ground and channeling heat away. Therefore, connecting the GND pin to ground with a large pad or ground plane would increase the power dissipation and reduce the device temperature. |
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Similar Description - AIC1730-28 |
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