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AIC1733-33GX5 Datasheet(PDF) 10 Page - Analog Intergrations Corporation |
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AIC1733-33GX5 Datasheet(HTML) 10 Page - Analog Intergrations Corporation |
10 / 13 page AIC1733 10 CURRENT LIMIT (IIL) AIC1733 includes a current limiting, which monitors and controls the maximum output current if the output is shorted to ground. This can protect the device from being damaged. THERMAL PROTECTION Thermal sensor protects device when the junction temperature exceeds TJ= +155ºC. It signals shutdown logic, turning off pass transistor and allowing IC to cool down. After the IC’s junction temperature cools by 15ºC, the thermal sensor will turn the pass transistor back on. Thermal protection is designed to protect the device in the event of fault conditions. For a continuous operation, do not exceed the absolute maximum junction-temperature rating of TJ= 150ºC, or damage may occur to the device. APPLICATION INFORMATION INPUT-OUTPUT CAPACITORS Linear regulators require input and output capacitors to maintain stability. Input capacitor at 1 µF with a 4.7uF aluminum electrolytic output capacitor is recommended. NOISE BYPASS CAPACITOR 0.1 µF bypass capacitor at BP pin reduces output voltage noise. And the BP pin has to connect a capacitor to GND. POWER DISSIPATION The maximum power dissipation of AIC1733 depends on the thermal resistance of its case and circuit board, the temperature difference between the die junction and ambient air, and the rate of airflow. The rate of temperature rise is greatly affected by the mounting pad configuration on the PCB, the board material, and the ambient temperature. When the IC mounting with good thermal conductivity is used, the junction temperature will be low even when large power dissipation applies. The power dissipation across the device is P = IOUT (VIN-VOUT). The maximum power dissipation is: ) R θ (R θ ) T (T P BA JB A J MAX + − = Where TJ-TA is the temperature difference between the die junction and the surrounding air, R θ JB is the thermal resistance of the package, and R θ BA is the thermal resistance through the PCB, copper traces, and other materials to the surrounding air. As a general rule, the lower temperature is, the better reliability of the device is. So the PCB mounting pad should provide maximum thermal conductivity to maintain low device temperature. GND pin performs a dual function of providing an electrical connection to ground and channeling heat away. Therefore, connecting the GND pin to ground with a large pad or ground plane would increase the power dissipation and reduce the device temperature |
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