Assembled

8.25mm +

IC thickness

32.225mm

32.225mm

A

A

Recommended torque = 9 in lbs./

144 in oz.

5

Insulation Plate: FR4/G10, 1.59mm thick.

All tolerances: ±0.125mm (unless stated

otherwise). Materials and specifications

are subject to change without notice.

Features

Status: Released

Drawing: Meghann Fedde

Scale: -

Rev: H

Date: 8/17/01

File: SG-BGA-6009 Dwg

SG-BGA-6009 Drawing

© 2001 IRONWOOD ELECTRONICS, INC.

PO BOX 21151 ST. PAUL, MN 55121

Tele: (651) 452-8100

www.ironwoodelectronics.com

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8

6

3

High speed, reliable Elastomer connection

Compression plate distributes forces evenly

Ball guide prevents over compression of elastomer

Minimum real estate required

Directly mounts to target PCB (needs tooling holes) with hardware.

Customer's Target PCB

Customer's

BGA IC

4

Top View

Side View

(Section AA)

Easily removable swivel socket lid

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7

9

Modified: 5/19/09

PAGE 1 of 4

10

Socket Lid: Black anodized Aluminum.

Thickness = 2.5mm.

Socket base screw: Fillister head, Alloy steel with

black oxide finish, 0-80 fine thread , 12.7mm long.

1

Elastomer Guide: Non-clad FR4.

Thickness = 0.725mm.

Compression Plate: Black anodized Aluminum.

Thickness = 2.5mm.

Elastomer: 40 micron dia gold plated brass

filaments arranged symmetrically in a silicone

rubber (63.5 degree angle).

Thickness = 0.75mm.

Socket base: Black anodized Aluminum.

Thickness = 5mm.

Ball Guide: Kapton polyimide.

Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine

thread.

10

Compression screw: Clear anodized Aluminum.

Thickness = 5mm, Hex socket = 5mm.

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3

4

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9

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11

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Backing Plate: Anodized Aluminum 6.35mm thick.