MBR2H200SF

www.onsemi.com

5

PACKAGE DIMENSIONS

SOD−123FL

CASE 498

ISSUE D

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH.

4. DIMENSIONS D AND J ARE TO BE MEASURED ON FLAT SECTION

OF THE LEAD: BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.

D

E

b

A

A1

L

c

POLARITY INDICATOR

OPTIONAL AS NEEDED

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

DIM

A

MIN

NOM

MAX

MIN

MILLIMETERS

0.90

0.95

0.98

0.035

INCHES

A1

0.00

0.05

0.10

0.000

b

0.70

0.90

1.10

0.028

c

0.10

0.15

0.20

0.004

D

1.50

1.65

1.80

0.059

E

2.50

2.70

2.90

0.098

L

0.55

0.75

0.95

0.022

0.037

0.039

0.002

0.004

0.035

0.043

0.006

0.008

0.065

0.071

0.106

0.114

0.030

0.037

NOM

MAX

3.40

3.60

3.80

0.134

0.142

0.150

−

−

0

°

8

°

0

°

8

°

q

q

q

TOP VIEW

BOTTOM VIEW

SIDE VIEW

2X

2X

END VIEW

RECOMMENDED

DIMENSIONS: MILLIMETERS

1.25

2X

4.20

1.22

2X

12

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