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SG-BGA-6090 Datasheet(PDF) 2 Page - Ironwood Electronics. |
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SG-BGA-6090 Datasheet(HTML) 2 Page - Ironwood Electronics. |
2 / 3 page Status: Released Drawing: H. Hansen Scale: 3:1 Date: 2/3/04 File: SG-BGA-6090 Dwg.mcd SG-BGA-6090 Drawing © 2009 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com PAGE 2 of 3 Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. Recommended PCB Layout Top View Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask *Note: BGA pattern is not symmetrical with respect to the mounting holes. Rev: C Modified: 7/6/09, AE Socket Body Size Non plated mounting hole Non plated alignment hole Orientation Mark 1.25mm±0.13mm(x4) 1.25mm±0.13mm(x4) 5.08mm Ø 1.61mm±0.05mm(x4) Ø 0.85mm±0.025mm (x2) Ø 0.54mm pad (x100) 2.54mm 16.225mm±0.125mm (x4) 13.725mm (x4) 1mm typ. 2.36mm 2.74mm* 1.25mm 6.33mm 1.25mm 3.79mm |
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Similar Description - SG-BGA-6090 |
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