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SG-BGA-6039 Datasheet(PDF) 3 Page - Ironwood Electronics. |
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SG-BGA-6039 Datasheet(HTML) 3 Page - Ironwood Electronics. |
3 / 4 page Status: Released Drawing: H. Hansen Scale: - Rev: F Date: 3/13/02 File: SG-MGA-6039 Dwg SG-BGA-6039 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Modified: 7/09/09, AE PAGE 3 of 4 D E Øb TOP VIEW SIDE VIEW Compatible BGA Spec 0.20 BOTTOM VIEW e DIM MIN MAX A 1.7 A1 0.7 b 0.9 D E e 40.0 BSC 40.0 BSC 1.27 BSC 3 4 5 Dimensions are in millimeters. Interpret dimensions and tolerances per ASME Y14.5M-1994. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. Datum Z (seating plane) is defined by the spherical crowns of the solder balls. Parallelism measurement shall exclude any effect of mark on top surface of package. 1. 2. 0.5 A3 0.2 Array: 31x31 X Y DETAIL 3 Ø0.30 Ø0.15 Z X Y Z A A1 DETAIL 0.2 Z Z 0.25 Z 5 4 A3 |
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