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P9025AC-RNBGI8 Datasheet(PDF) 2 Page - Integrated Device Technology |
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P9025AC-RNBGI8 Datasheet(HTML) 2 Page - Integrated Device Technology |
2 / 20 page 5W, QI WIRELESS POWER RECEIVER WITH INTEGRATED RECTIFIER AND LDO OUTPUT 2 09/01/15 P9025AC DATASHEET Absolute Maximum Ratings Stresses above the ratings listed below (Table 1 and Table 2) can cause permanent damage to the P9025AC. These ratings, which are standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating temperature range. Table 1: Absolute Maximum Ratings Summary Table 2: Package Thermal Information1,2,3,4 NOTES: 1. The maximum power dissipation is PD(MAX) = (TJ(MAX) - TA) / ΘJA where TJ(MAX) is 125°C. Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the device will enter thermal shutdown. 2. This thermal rating was calculated on JEDEC 51 standard 4-layer board with dimensions 3" x 4.5" in still air conditions. 3. Actual thermal resistance is affected by PCB size, solder joint quality, layer count, copper thickness, air flow, altitude, and other unlisted variables. 4. For the NBG32 package, connecting the 5 mm X 5 mm EP to internal/external ground planes with a 5x5 matrix of PCB plated-through-hole (PTH) vias, from top to bottom sides of the PCB, is recommended for improving the overall thermal performance. Table 3: ESD Information Pins Rating Units AC1, AC2, VRECT, ACM1, ACM2, CLAMP1, CLAMP2 to PGND_ -0.3 to 20 V BST1, BST2 to PGND1 -0.3 to (AC1, AC2 + 6) V INT, EN, STAT, SCL, SDA, OUT, SNS, TEOP, RLIM, CHG_END/CS100, FOD1, FOD2, VDD to AGND -0.3 to 6 V PGND, PGND1, PGND2, to AGND -0.3 to 0.3 V Out Current 1.5 A AC1, AC2 Current 2ARMS Symbol Description Rating (VFQFPN) Units ΘJA Thermal Resistance Junction to Ambient 35 C/W ΘJC Thermal Resistance Junction to Case 29.6 C/W ΘJB Thermal Resistance Junction to Board 2.4 C/W TJ Operating Junction Temperature 0 to +125 C TA Ambient Operating Temperature 0 to +85 C TSTG Storage Temperature -55 to +150 C TLEAD Lead Temperature (soldering, 10s) 300 C Test Model Pins Ratings Units HBM All pins ±1500 V CDM All pins ±500 V |
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