Status: Released

Drawing: H. Hansen

Scale: 2:1

Rev: C

Date: 3/19/04

File: SG-BGA-6115 Dwg

SG-BGA-6115 Drawing

© 2009 IRONWOOD ELECTRONICS, INC.

11351 Rupp Drive, Suite 400, Burnsville, MN 55337

Tele: (952) 229-8200

www.ironwoodelectronics.com

Modified: 11/4/09

PAGE 2 of 4

Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise.

Recommended PCB Layout

Top View

Target PCB Recommendations

Total thickness: 2.4mm min.

Plating: Gold or Solder finish

PCB Pad height: Same or higher than solder mask

NOTE: Steel backing plate may be required based on end user's application

*Note: BGA pattern is not symmetrical

with respect to the mounting holes. It is

offset by 0.375mm to the right of center

with respec to the mounting holes.

Non plated mounting hole

Non plated alignment hole

Orientation Mark

1.25mm±0.13mm(x4)

1.25mm±0.13mm(x4)

42.725mm±0.125mm(x4)

5.08mm

20.113mm(x8)

1.27mm typ.

2.54mm

Ø 1.61mm±0.05mm(x8)

Ø 0.85mm±0.025mm(x2)

Ø 0.635mmxPAD

2.71mm*

Socket size

45.225mm (x4)

2.5mm±0.13mm

2.5mm±0.13mm

2.33mm

Backing plate size