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LM77000CP Datasheet(PDF) 6 Page - National Semiconductor (TI) |
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LM77000CP Datasheet(HTML) 6 Page - National Semiconductor (TI) |
6 / 14 page Typ Max Typ Max Package iJC iJC iJA iJA CW CW CW CW Plastic Package (P) 80 12 75 80 Metal Can (H) 30 40 120 150 PD Max e TJ Max b TA iJC a iCA or e TJ Max b TA iJA (without a heat sink) iCA e iCS a iSA Solving TJ TJ e TA a PD (iJC a iCA)or e TA a PDiJA (without a heat sink) Where TJ e Junction Temperature TA e Ambient Temperature PD e Power Dissipation iJA e Junction to ambient thermal resistance iJC e Junction to case thermal resistance iCA e Case to ambient thermal resistance iCS e Case to heat sink thermal resistance iSA e Heat sink to ambient thermal resistance Mounting Hints Metal Can Package (LM759CHLM759MH) The LM759 in the 8-Lead TO-99 metal can package must be used with a heat sink With g15V power supplies the LM759 can dissipate up to 540 mW in its quiescent (no load) state This would result in a 100 C rise in chip temper- ature to 125 C (assuming a 25 C ambient temperature) In order to avoid this problem it is advisable to use either a slip on or stud mount heat sink with this package If a stud mount heat sink is used it may be necessary to use insulat- ing washers between the stud and the chassis because the case of the LM759 is internally connected to the negative power supply terminal Plastic Package (LM759CPLM77000CP) The LM759CP and LM77000CP are designed to be at- tached by the tab to a heat sink This heat sink can be either one of the many heat sinks which are commercially avail- able a piece of metal such as the equipment chassis or a suitable amount of copper foil as on a double sided PC board The important thing to remember is that the negative power supply connection to the op amp must be made through the tab Furthermore adequate heat sinking must be provided to keep the chip temperature below 125 C un- der worst case load and ambient temperature conditions 6 |
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Similar Description - LM77000CP |
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