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SG-BGA-6197 Datasheet(PDF) 2 Page - Ironwood Electronics. |
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SG-BGA-6197 Datasheet(HTML) 2 Page - Ironwood Electronics. |
2 / 4 page Status: Released Drawing: J. Glab Scale: 2:1 Rev: B Date: File: SG-BGA-6197 Dwg SG-BGA-6197 Drawing Modified: 7/21/09, AE PAGE 2 of 4 Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. Recommended PCB Layout Top View Target PCB Recommendations Total thickness: 2.4mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask NOTE: Steel backing plate may be required based on end user's application *Note: BGA pattern is not symmetrical with respect to the mounting holes. © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com 1.25mm±0.13mm (x4) 1.25mm±0.13mm (x4) 45.225mm±0.125mm(x4) 5.08mm 21.363mm(x8) 1mm typ. 2.54mm Ø 1.61mm±0.05mm (x8) Ø 0.85mm±0.025mm (x2) Ø 0.635mm PAD 2.74mm* Socket size 47.725mm sqr. 2.36mm Backing plate size Orientation Mark 1.99mm Non plated mounting hole Non plated alignment hole Note: Full BGA pattern shown. Please adjust pattern according to individual requirements. |
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