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THS4130IDGN Datasheet(PDF) 2 Page - Texas Instruments |
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THS4130IDGN Datasheet(HTML) 2 Page - Texas Instruments |
2 / 27 page THS4130, THS4131 HIGHSPEED, LOW NOISE, FULLY DIFFERENTIAL I/O AMPLIFIERS SLOS318E − MAY 2000 − REVISED JANUARY 2004 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 AVAILABLE OPTIONS PACKAGED DEVICES EVALUATION TA SMALL OUTLINE MSOP PowerPAD MSOP EVALUATION MODULES TA SMALL OUTLINE (D) (DGN) SYMBOL (DGK) SYMBOL MODULES 0 °C to 70°C THS4130CD THS4130CDGN AOB THS4130CDGK ATP THS4130EVM 0 °C to 70°C THS4131CD THS4131CDGN AOD THS4131CDGK ATQ THS4131EVM −40 °C to 85°C THS4130ID THS4130IDGN AOC THS4130IDGK ASO − −40 °C to 85°C THS4131ID THS4131IDGN AOE THS4131IDGK ASP − absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage, VCC− to VCC+ ±33 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input voltage, VI ±VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Output current, IO (see Note 1) 150 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Differential input voltage, VID ±6 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous total power dissipation See Dissipation Rating Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Maximum junction temperature, TJ (see Note 2) 150 °C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Maximum junction temperature, continuous operation, long term reliability, TJ (see Note 3) 125 °C . . . . . . . . Operating free-air temperature, TA:C suffix 0 °C to 70°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I suffix −40 °C to 85°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Storage temperature, Tstg −65 °C to 150°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Lead temperature 1,6 mm (1/16 Inch) from case for 10 seconds 300 °C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ESD ratings: HBM 2500 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CDM 1500 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MM 200 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: The THS413x may incorporate a PowerPad on the underside of the chip. This acts as a heatsink and must be connected to a thermally dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which could permanently damage the device. See TI technical brief SLMA002 and SLMA004 for more information about utilizing the PowerPad thermally enhanced package. NOTE 2: The absolute maximum temperature under any condition is limited by the constraints of the silicon process. NOTE 3: The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may result in reduced reliability and/or lifetime of the device. DISSIPATION RATING TABLE PACKAGE θJA ‡ θJC POWER RATING§ PACKAGE θJA ‡ ( °C/W) θJC ( °C/W) TA = 25°C TA = 85°C D 97.5 38.3 1.02 W 410 mW DGN 58.4 4.7 1.71 W 685 mW DGK 260 54.2 385 mW 154 mW ‡ This data was taken using the JEDEC standard High−K test PCB. § Power rating is determined with a junction temperature of 125°C. This is the point where distortion starts to substantially increase. Thermal management of the final PCB should strive to keep the junction temperature at or below 125 °C for best performance and long term reliability. recommended operating conditions MIN TYP MAX UNIT Supply voltage, VCC+ to VCC− Dual supply ±2.5 ±15 V Supply voltage, VCC+ to VCC− Single supply 5 30 V Operating free-air temperature, TA C suffix 0 70 °C Operating free-air temperature, TA I suffix −40 85 °C PowerPAD is a trademark of Texas Instruments. |
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