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and Reel for Pick and

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Model XC0900P-03AS

Rev D

Power Handling

The average power handling (total input power) of a Xinger coupler is a function of:



Internal circuit temperature.



Unit mounting interface temperature.



Unit thermal resistance



Power dissipated within the unit.

All thermal calculations are based on the following assumptions:



The unit has reached a steady state operating condition.



Maximum mounting interface temperature is 85



Conduction Heat Transfer through the mounting interface.



No Convection Heat Transfer.



No Radiation Heat Transfer.



The material properties are constant over the operating temperature range.

Finite element simulations are made for each unit. The simulation results are used to calculate the unit thermal

resistance. The finite element simulation requires the following inputs:



Unit material stack-up.



Material properties.



Circuit geometry.



Mounting interface temperature.



Thermal load (dissipated power).

The classical definition for dissipated power is temperature delta (

)

(

10

1

10

W

P

R

T

P

therm

IL

in

dis

























(1)

Power flow and nomenclature for an “X” style coupler is shown in Figure 1.