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SG-BGA-6266 Datasheet(PDF) 3 Page - Ironwood Electronics. |
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SG-BGA-6266 Datasheet(HTML) 3 Page - Ironwood Electronics. |
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3 / 4 page  PAGE 3 of 4 Status: Released Drawing: M. Raske Scale: - Rev: A Date: 01/17/2014 File: SG-BGA-6266 Dwg.mcd SG-BGA-6266 Drawing Modified: © 2009 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com 27x27 array D E A Ø b e Ø0.25 Ø0.10 X Y 0.20 Z X Y Z 3 4 5 Dimensions are in millimeters. Interpret dimensions and tolerances per ASME Y14.5M-1994. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. Datum Z (seating plane) is defined by the spherical crowns of the solder balls. Parallelism measurement shall exclude any effect of mark on top surface of package. 1. 2. DIM MIN MAX A 2.15 A1 0.35 b 0.50 D E e 0.8 BSC 0.25 23.0 BSC 23.0 BSC Top View Side View Bottom View Array:27x27 0.20 Z A1 Compatible BGA Spec. 3 4 5 |
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