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SG-BGA-6302 Datasheet(PDF) 2 Page - Ironwood Electronics. |
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SG-BGA-6302 Datasheet(HTML) 2 Page - Ironwood Electronics. |
2 / 4 page PAGE 2 of 4 Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. Recommended PCB Layout Top View Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask NOTE: Steel backing plate may be required based on end user's application Status: Released Drawing: E Smolentseva Scale: - Date: 3/3/10 File: SG-BGA-6302 Dwg.mcd SG-BGA-6302 Drawing © 2010 IRONWOOD ELECTRONICS, INC. 11351 Rupp Dr. Ste 400 Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Rev: A Modified: Orientation Mark 2.5mm±0.13mm typ. 2.5mm±0.13mm typ. 43.23mm±0.125mm typ. 13.7825mm 19.115mm(x8) 1mm typ. Ø 0.85mm±0.025mm non plated alignment hole (x2) Ø 0.51mm pad (x1156) 2.99mm* (socket body) 2.615mm Note: BGA pattern is not symmetrical with respect to the mounting holes. 33mm 33mm Note: Full BGA pattern shown. Please adjust pattern according to individual requirements. Ø 3mm±0.1mm non plated mounting hole (x4) Ø 1.71mm±0.1mm (x4) 18.8625mm (x8) 16.3225mm |
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