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SG-BGA-6298 Datasheet(PDF) 1 Page - Ironwood Electronics.

Part # SG-BGA-6298
Description  Ball guide prevents over compression of elastomer
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Manufacturer  IRONWOOD [Ironwood Electronics.]
Direct Link  http://www.ironwoodelectronics.com
Logo IRONWOOD - Ironwood Electronics.

SG-BGA-6298 Datasheet(HTML) 1 Page - Ironwood Electronics.

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All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
GHz BGA Socket - Direct mount, solderless
Features
High speed, reliable Elastomer connection
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Minimum real estate required
Directly mounts to target PCB (needs tooling holes) with hardware.
Top View
Side View
(Section AA)
Easily removable swivel socket lid
Socket Lid: Black anodized Aluminum.
Thickness = 2.5mm.
Socket base screw: Socket head cap, alloy steel with
black oxide finish, 0-80 fine thread , 12.7mm long.
1
Elastomer Guide: Cirlex or equivalent.
Thickness = 0.725mm.
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
Elastomer: 40 micron dia gold plated brass
filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
Socket base: Black anodized Aluminum.
Thickness = 6.5mm.
Ball Guide: Kapton polyimide.
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
thread.
10
Insulation Plate: Ultem, Thickness = 3mm.
Compression screw: Clear anodized Aluminum.
Thickness = 5mm, Hex socket = 5mm.
2
3
4
5
7
9
6
8
11
Backing Plate: Black anodized Aluminum.
Thickness = 6.35mm.
Assembled
8.25mm +
IC thickness
Recommended torque = 10 in lbs./
160 in oz.
5
1
8
6
3
Customer's Target PCB
Customer's
BGA IC
4
2
7
9
10
11
34.325mm
34.325mm
A
A
12
IC Frame: Ultem
Status: Released
Drawing: E Smolentseva
Scale: NA
Rev: A
Date: 1/21/10
Modified:
File: SG-BGA-6298 Dwg.mcd
SG-BGA-6298 Drawing
PAGE 1 of 4
© 2010 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com


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