D

E

13.29**

13.35**

7.29**

7.35**

A1 MARK

0.86±0.03*

A1

A

0.2 Z

0.25 Z

Z

b (x784 balls)*

e

Dimensions are in millimeters.

Interpret dimensions and tolerances per ASME Y14.5M-1994.

1.

Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z.

2.

Datum Z (seating plane) is defined by the spherical crowns of the solder balls.

3.

Parallelism measurement shall exclude any effect of mark on top surface of package.

4.

* FULL ARRAY SHOWN SOCKET WILL WORK WITH DEPOPULATED PACKAGE

** IF DIE NOT PRESENT USE SOCKET WITHOUT IC FRAME SHOWN ON PAGE 4

COMPATIBLE IRONWOOD PACKAGE CODE: BGA784C

Array: 28 x 28

DIM

MIN

MAX

A

-

2.5

A1

0.21

0.31

b

0.35

0.45

D

22.8

23.2

E

22.8

23.2

e

0.8

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all

other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.

Description: Compatible Device

Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.

STATUS: Released

REV. A

DATE: 07/02/2014

Material: N/A

Finish: N/A

Weight: 25.56

SG-BGA-6408 Drawing

SCALE: 3:1

SHEET: 3 OF 4

ENG: B. Schatz

FILE: SG-BGA-6408 Dwg

DRAWN BY: M. Raske