Status: Released

Drawing: M.A. Fedde

Scale: 4:1

Rev: A

Date: 5/4/12

File: SG-BGA-7235 Dwg

SG-BGA-7235 Drawing

© 2012 IRONWOOD ELECTRONICS, INC.

Tele: (952) 229-8200

www.ironwoodelectronics.com

Modified:

PAGE 2 of 4

Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise.

Recommended PCB Layout

Top View

Target PCB Recommendations

Total thickness: 1.6mm min.

Plating: Gold or Solder finish

PCB Pad height: Same or higher than solder mask

*Note: BGA pattern is not symmetrical

with respect to the mounting holes. It is

offset by 0.25mm to the right of center

with respect to mounting holes.

Note: Full BGA pattern shown.

Please adjust pattern according

to individual requirements.

All dimensions are in mm unless stated otherwise

Socket Body

Size

Non plated mounting hole

Non plated alignment hole

Orientation Mark

1.25mm±0.13mm (x4)

1.25mm±0.13mm (x4)

5.08mm

16.225mm±0.125mm (x4)

13.725mm (x4)

2.54mm

Ø 0.3mm pad

2.36mm

9mm

*2.61mm

0.5mm typ.

Ø 0.85mm±0.025mm (x2)

Ø 1.61mm±0.05mm (x4)

9mm

18.73mm sqr.

backing plate outline