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SG-BGA-7235 Datasheet(PDF) 2 Page - Ironwood Electronics. |
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SG-BGA-7235 Datasheet(HTML) 2 Page - Ironwood Electronics. |
2 / 4 page Status: Released Drawing: M.A. Fedde Scale: 4:1 Rev: A Date: 5/4/12 File: SG-BGA-7235 Dwg SG-BGA-7235 Drawing © 2012 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Modified: PAGE 2 of 4 Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. Recommended PCB Layout Top View Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask *Note: BGA pattern is not symmetrical with respect to the mounting holes. It is offset by 0.25mm to the right of center with respect to mounting holes. Note: Full BGA pattern shown. Please adjust pattern according to individual requirements. All dimensions are in mm unless stated otherwise Socket Body Size Non plated mounting hole Non plated alignment hole Orientation Mark 1.25mm±0.13mm (x4) 1.25mm±0.13mm (x4) 5.08mm 16.225mm±0.125mm (x4) 13.725mm (x4) 2.54mm Ø 0.3mm pad 2.36mm 9mm *2.61mm 0.5mm typ. Ø 0.85mm±0.025mm (x2) Ø 1.61mm±0.05mm (x4) 9mm 18.73mm sqr. backing plate outline |
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