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TLC072A Datasheet(HTML) 24 Page - Texas Instruments

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Part No. TLC072A
Description  FAMILY OF WIDE BAND WIDTH HIGH OUTPUT DRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS
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Maker  TI [Texas Instruments]
Homepage  http://www.ti.com
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TLC072A Datasheet(HTML) 24 Page - Texas Instruments

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TLC070, TLC071, TLC072, TLC073, TLC074, TLC075, TLC07xA
FAMILY OF WIDEBANDWIDTH HIGHOUTPUT DRIVE SINGLE SUPPLY
OPERATIONAL AMPLIFIERS
SLOS219D − JUNE 1999 − REVISED FEBRUARY 2004
24
WWW.TI.COM
POST OFFICE BOX 1443
HOUSTON, TEXAS 77251−1443
APPLICATION INFORMATION
general PowerPAD design considerations (continued)
TJ = 150°C
4
3
2
0
−55 −40
−10
20 35
5
6
MAXIMUM POWER DISSIPATION
vs
FREE-AIR TEMPERATURE
7
65
95
125
1
TA − Free-Air Temperature − °C
DGN Package
Low-K Test PCB
θJA = 52.3°C/W
SOT-23 Package
Low-K Test PCB
θJA = 324°C/W
−25
5
50
80
110
PWP Package
Low-K Test PCB
θJA = 29.7°C/W
SOIC Package
Low-K Test PCB
θJA = 176°C/W
PDIP Package
Low-K Test PCB
θJA = 104°C/W
NOTE A: Results are with no air flow and using JEDEC Standard Low-K test PCB.
Figure 54. Maximum Power Dissipation vs Free-Air Temperature
The next consideration is the package constraints. The two sources of heat within an amplifier are quiescent
power and output power. The designer should never forget about the quiescent heat generated within the
device, especially multi-amplifier devices. Because these devices have linear output stages (Class A-B), most
of the heat dissipation is at low output voltages with high output currents.
The other key factor when dealing with power dissipation is how the devices are mounted on the PCB. The
PowerPAD devices are extremely useful for heat dissipation. But, the device should always be soldered to a
copper plane to fully use the heat dissipation properties of the PowerPAD. The SOIC package, on the other
hand, is highly dependent on how it is mounted on the PCB. As more trace and copper area is placed around
the device,
θJA decreases and the heat dissipation capability increases. The currents and voltages shown in
these graphs are for the total package. For the dual or quad amplifier packages, the sum of the RMS output
currents and voltages should be used to choose the proper package.


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