20.225

28.225

A

A

2.500

20.650

22.270

28.225

6.000

20.725

20.225

B

SECTION A-A

DETAIL B

SCALE 16 : 1

Interposer

PCB

Ball Guide

DUT

Interposer Protective Layer

IC Guide

SMP-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR

BURN-IN AND TEST APPLICATIONS

FEATURES:

Wide temperature range (-55C to +155C )

High current capability (up to 4A )

Excellent signal integrity at high frequencies

Low and stable contact resistance for reliable production yield

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all

other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.

Description: SMP-BGA424 12mm IC 23x23 0.5mm pitch

Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.

STATUS: Released

REV. A

DATE: 08/19/2014

Material: N/A

Finish: N/A

Weight: 27.12

SMP-BGA-8005 Drawing

SCALE: 2:1

SHEET: 1 OF 4

ENG: M.A. Fedde

FILE: SMP-BGA-8005 Dwg

DRAWN BY: M. Raske