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TPS61240IDRVRQ1 Datasheet(PDF) 5 Page - Texas Instruments |
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TPS61240IDRVRQ1 Datasheet(HTML) 5 Page - Texas Instruments |
5 / 26 page 5 TPS61240-Q1 www.ti.com SLVSAO4B – DECEMBER 2010 – REVISED MARCH 2017 Product Folder Links: TPS61240-Q1 Submit Documentation Feedback Copyright © 2010–2017, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network ground terminal. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT Input voltage, VI (on VIN, L, and EN) –0.3 7 V Voltage on VOUT –2 7 V Voltage on FB –2 14 V Peak output current Internally limited Operating junction temperature, TJ –40 125 °C Storage temperature, Tstg –65 150 °C (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) ±2000 V Charged-device model (CDM), per AEC Q100-011 ±1000 (1) In applications where high power dissipation, poor package thermal resistance, or both are present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA(max)) is dependent on the maximum operating junction temperature (TJ(max)), the maximum power dissipation of the device in the application (PD(max)), and the junction-to-ambient thermal resistance of the device or package in the application (RθJA), as given by the following equation: TA(max)= TJ(max) – (RθJA × PD(max)) 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Supply voltage at VIN 2.3 5.5 V L Inductance 1 2.2 µH Cout Output capacitance 1 20 µF TA Operating ambient temperature(1) TPS61240IDRVRQ1 –40 85 °C TPS61240TDRVRQ1 –40 105 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information THERMAL METRIC(1) TPS61240-Q1 UNIT DRV (WSON) 6 PINS RθJA Junction-to-ambient thermal resistance 67.8 °C/W RθJC(top) Junction-to-case (top) thermal resistance 71.4 °C/W RθJB Junction-to-board thermal resistance 37.5 °C/W ψJT Junction-to-top characterization parameter 1.8 °C/W ψJB Junction-to-board characterization parameter 37.8 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 8.7 °C/W |
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