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TPS61240IDRVRQ1 Datasheet(PDF) 5 Page - Texas Instruments

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Part # TPS61240IDRVRQ1
Description  3.5-MHz High Efficiency Step-Up Converter
Download  26 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TPS61240IDRVRQ1 Datasheet(HTML) 5 Page - Texas Instruments

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5
TPS61240-Q1
www.ti.com
SLVSAO4B – DECEMBER 2010 – REVISED MARCH 2017
Product Folder Links: TPS61240-Q1
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Copyright © 2010–2017, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltage values are with respect to network ground terminal.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2)
MIN
MAX
UNIT
Input voltage, VI (on VIN, L, and EN)
–0.3
7
V
Voltage on VOUT
–2
7
V
Voltage on FB
–2
14
V
Peak output current
Internally limited
Operating junction temperature, TJ
–40
125
°C
Storage temperature, Tstg
–65
150
°C
(1)
AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per AEC Q100-002(1)
±2000
V
Charged-device model (CDM), per AEC Q100-011
±1000
(1)
In applications where high power dissipation, poor package thermal resistance, or both are present, the maximum ambient temperature
may have to be derated. Maximum ambient temperature (TA(max)) is dependent on the maximum operating junction temperature
(TJ(max)), the maximum power dissipation of the device in the application (PD(max)), and the junction-to-ambient thermal resistance of the
device or package in the application (RθJA), as given by the following equation: TA(max)= TJ(max) – (RθJA × PD(max))
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
Supply voltage at VIN
2.3
5.5
V
L
Inductance
1
2.2
µH
Cout
Output capacitance
1
20
µF
TA
Operating ambient temperature(1)
TPS61240IDRVRQ1
–40
85
°C
TPS61240TDRVRQ1
–40
105
°C
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.4 Thermal Information
THERMAL METRIC(1)
TPS61240-Q1
UNIT
DRV (WSON)
6 PINS
RθJA
Junction-to-ambient thermal resistance
67.8
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
71.4
°C/W
RθJB
Junction-to-board thermal resistance
37.5
°C/W
ψJT
Junction-to-top characterization parameter
1.8
°C/W
ψJB
Junction-to-board characterization parameter
37.8
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
8.7
°C/W


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