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AF1218DR-139R76 Datasheet(PDF) 7 Page - YAGEO Corporation

Part # AF1218DR-139R76
Description  ANTI-SULFURATED CHIP RESISTORS
Download  9 Pages
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Manufacturer  YAGEO [YAGEO Corporation]
Direct Link  http://www.yageo.com
Logo YAGEO - YAGEO Corporation

AF1218DR-139R76 Datasheet(HTML) 7 Page - YAGEO Corporation

  AF1218DR-139R76 Datasheet HTML 1Page - YAGEO Corporation AF1218DR-139R76 Datasheet HTML 2Page - YAGEO Corporation AF1218DR-139R76 Datasheet HTML 3Page - YAGEO Corporation AF1218DR-139R76 Datasheet HTML 4Page - YAGEO Corporation AF1218DR-139R76 Datasheet HTML 5Page - YAGEO Corporation AF1218DR-139R76 Datasheet HTML 6Page - YAGEO Corporation AF1218DR-139R76 Datasheet HTML 7Page - YAGEO Corporation AF1218DR-139R76 Datasheet HTML 8Page - YAGEO Corporation AF1218DR-139R76 Datasheet HTML 9Page - YAGEO Corporation  
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Chip Resistor Surface Mount
www.yageo.com
Jun. 21, 2016 V.5
Product specification
7
9
SERIES
AF
0201 to 2512
TESTS AND REQUIREMENTS
TEST
TEST METHOD
PROCEDURE
REQUIREMENTS
Temperature
Coefficient of
Resistance
(T.C.R.)
IEC 60115-1 4.8
MIL-STD-202 Method 304
At +25/–55 °C and +25/+125 °C
Refer to table 2
Formula:
T.C.R= ------------------------- × 106 (ppm/°C)
Where
t1=+25 °C or specified room temperature
t2=–55 °C or +125 °C test temperature
R1=resistance at reference temperature in ohms
R2=resistance at test temperature in ohms
Life/Endurance
IEC 60115-1 4.25
MIL-STD-202 Method 108
At 70± 2 °C for 1,000 hours, RCWV applied for
1.5 hours on, 0.5 hour off, still-air required
± (1.0%+0.05 Ω)
<100 mΩ for Jumper
High
Temperature
Exposure
MIL-STD-202 Method 108
1,000 hours at 155±3℃
unpowered
± (1.0%+0.05 Ω)
<100 mΩ for Jumper
Moisture
Resistance
MIL-STD-202 Method 106
Each temperature / humidity cycle is defined at 8
hours, 3 cycles / 24 hours for 10d. with 25 °C /
65 °C 95% R.H, without steps 7a & 7b,
unpowered
Parts mounted on test-boards, without
condensation on parts
± (0.5%+0.05 Ω) for 0.5%, 1%
tol.
± (1.0%+0.05 Ω) for 5% tol.
<100 mΩ for Jumper
Thermal Shock
MIL-STD-202 Method 107
–55 / +125 °C
Number of cycles required is 300. Devices
mounted
Maximum transfer time is 20 seconds. Dwell time
is 15 minutes
± (0.5%+0.05 Ω) for 0.5%, 1%
tol.
± (1%+0.05 Ω) for 5% tol.
<100 mΩ for Jumper
Short Time
Overload
IEC60115-1 4.13
2.5 times of rated voltage or maximum overload
voltage whichever is less for 5 seconds at room
temperature
± (1.0%+0.05 Ω)
No visible damage
Bending
IEC 60115-1 4.33
Chips mounted on a 90 mm glass epoxy resin
PCB (FR4)
Bending: 0201/0402: 5 mm
0603/0805: 3 mm
1206 & above: 2 mm
Bending time: 60± 5 seconds
± (1.0%+0.05 Ω)
<100 mΩ for Jumper
No visible damage
Table 4 Test condition, procedure and requirements
R2–R1
R1(t2–t1)


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