4

TCA9803

SCPS267 – MARCH 2017

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Copyright © 2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage on A-side

–0.5

4

V

Supply voltage on B-side

–0.5

4

V

Enable input voltage

–0.5

4

V

–0.5

4

V

20

mA

Input clamp current (SDAB/SCLB)

–20

mA

Input clamp current (EN, VCCA, VCCB, SDAA, SCLA)

–20

mA

Output clamp current (SDAB/SCLB)

–20

mA

Output clamp current (EN, VCCA, VCCB, SDAA, SCLA)

–20

mA

Operating junction

temperature

130

°C

Storage temperature

–60

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-

±2000

V

Charged device model (CDM), per JEDEC specification

±1000

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Operating free-air temperature

–40

125

°C

Supply voltage

0.8

3.6

V

Supply voltage

1.65

3.6

V

Input-output voltage

SDAA, SCLA

0

3.6

V

SDAB, SCLB

0

3.6

EN

0

3.6

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

TCA9803

UNIT

DGK (VSSOP)

8 PINS

Junction-to-ambient thermal resistance

174.1

°C/W

Junction-to-case (top) thermal resistance

85

°C/W

Junction-to-board thermal resistance

104.4

°C/W

Junction-to-top characterization parameter

18.3

°C/W

Junction-to-board characterization parameter

102.8

°C/W