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HFBR-5911L Datasheet(PDF) 3 Page - AVAGO TECHNOLOGIES LIMITED |
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HFBR-5911L Datasheet(HTML) 3 Page - AVAGO TECHNOLOGIES LIMITED |
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3 / 12 page  3 Electrical Interfaces The HFBR-5911L/AL interfaces with the host circuit board through the ten I/O pins identified by function in Table 4. These pins are sized for use in boards between 0.062 in. and 0.100 in. thick. The board layout for this interface is depicted in Figure 4. The HFBR-5911L/AL transmit and receive interfaces require PECL differential signal lines on the host board. To simplify board requirements, transmitter bias resistors and ac coupling capacitors are incorporated into the transceiver module and so are not required on the host board. The Tx_Disable and Signal Detect lines require TTL lines on the host board if they are to be utilized. The transceiver will operate normally if these lines are not connected on the host board. Figure 2 depicts a recommended interface circuit to link the HFBR-5911L/AL to the supporting physical layer ICs. Timing for the MSA compliant control signals implemented in this transceiver are listed in Table 9 and diagramed in Figure 5. PCB Assembly Process Compatibility The HFBR-5911L/AL is compatible with industry- standard wave solder and aqueous wash processes as detailed in Table 10. The transceiver is shipped with a process plug to keep out impinging liquids, but is not intended to be immersed. After assembly, the process plug should be kept in place as a dust plug when the transceiver is not in use. Regulatory Compliance The HFBR-5911L/AL complies with all applicable laws and regulations as detailed in Table 11. Certification level is dependent of the overall configuration of the host equipment. The transceiver performance is offered as a figure of merit to assist the designer. Electrostatic Discharge (ESD) The HFBR-5911L/AL is compatible with ESD levels found in typical manufacturing and operating environments as described in Table 11. In the normal handling and operation of optical transceivers, ESD is of concern in two circumstances. The first case is during handling of the transceiver prior to soldering onto the host board. To protect the device, it’s important to use normal ESD handling precautions. These include using grounded wrist straps, workbenches and floor mats wherever the transceiver is handled. The second case to consider is static discharges to the exterior of the host equipment chassis after assembly. If the optical interface is exposed to the exterior of the host equipment cabinet, the transceiver may be subject to system-level ESD requirements. EMI Immunity Due to its shielded design, the EMI immunity of the HFBR-5911L/AL exceeds typical industry standards. Electromagnetic Interference (EMI) Equipment incorporating Gigabit transceivers is typically subject to regulation by the FCC in the United States, TUV in the European Union and VCCI in Japan. The HFBR-5911L/AL’s compliance to these standards is detailed in Table 11. The metal housing and shielded design of the HFBR- 5911L/AL minimize the EMI challenge facing the equipment designer. Flammability The HFBR-5911L/AL optical transceiver is made of metal and high strength, heat resistant, chemical resistant and UL 94V-0 flame retardant plastic. Caution There are no user serviceable parts nor any maintenance required for the HFBR-5911L/AL. All adjustments are made at the factory before shipment. Tampering with, modifying, misusing or improperly handling the HFBR-5911L/AL will void the product warranty. It may also result in improper operation and possibly overstress the laser source. Performance degradation or device failure may result. Connection of the HFBR-5911L/AL to a light source not compliant to the Gigabit Ethernet specification (IEEE 802.3), operating above the recommended absolute maximum operating conditions or in a manner inconsistent with it’s design and function may result in exposure to hazardous radiation and may constitute an act of modifying or manufacturing a laser product. Person’s performing such an act are required by law to recertify and re-identify the laser product under the provisions of U.S. 21 CFR (Subchapter J). |
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