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MAX3272ED Datasheet(PDF) 10 Page - Maxim Integrated Products |
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MAX3272ED Datasheet(HTML) 10 Page - Maxim Integrated Products |
10 / 14 page +3.3V, 2.5Gbps Low-Power Limiting Amplifiers 10 ______________________________________________________________________________________ +3.3V +3.3V +3.3V CAZ CAZ1 OUTPOL CAZ2 VCC 0.1 µF 0.1 µF TH SQUELCH CCLOS *THE MAX3202E PROVIDES ESD PROTECTION ON THE LOS PIN CLOS 100 Ω IN- IN+ OUT+ SDI+ SDO+ VCC SDO- SCLKO- SCLKO+ SDI- GND CDR OUT- MAX3271 MAX3272 MAX3873 LOS GND LOSS OF SIGNAL LOS RTH LEVEL +3.3V VCC I/01 GND MAX3202E* Typical Operating Circuit (continued) Wire Bonding Die For high-current density and reliable operation, the MAX3272 uses gold metallization. Make connections to the dice with gold wire only, and use ball-bonding tech- niques (wedge bonding is not recommended). Die pad dimensions are 94.4 microns by 94.4 microns. Die thickness is 15 mils (0.375mm). |
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