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VE1812M801R075 Datasheet(PDF) 8 Page - Kemet Corporation |
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VE1812M801R075 Datasheet(HTML) 8 Page - Kemet Corporation |
8 / 15 page 8 © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com V0003_VE • 10/26/2016 SMD Varistors VE Series – SMD 150°C Low Voltage High Temperature Varistors Soldering PopularsolderingtechniquesusedforsurfacemountedcomponentsareWaveandInfraredReflowprocesses.Bothprocessescanbe performed with Pb-containing or Pb-free solders. The termination option available for these soldering techniques is Barrier Type End Terminations. End Termination Designation Recommended and Suitable for Component RoHS Compliant Ni Sn Barrier Type End Termination Ni R1 Pb-containing and Pb-free soldering Yes Wave Soldering – this process is generally associated with discrete components mounted on the underside of printed circuit boards, or for large top-side components with bottom-side mounting tabs to be attached, such as the frames of transformers, relays, connectors, etc.SMDvaristorstobewavesolderedarefirstgluedtothecircuitboard,usuallywithanepoxyadhesive.Whenallcomponentsonthe PCB have been positioned and an appropriate time is allowed for adhesive curing, the completed assembly is then placed on a conveyor and run through a single, double wave process. Infrared Reflow Soldering–thesereflowprocessesaretypicallyassociatedwithtop-sidecomponentplacement.Thistechniqueutilizes amixtureofadhesiveandsoldercompounds(andsometimesfluxes)thatareblendedintoapaste.ThepasteisthenscreenedontoPCB solderingpadsspecificallydesignedtoacceptaparticularsizedSMDcomponent.Therecommendedsolderpastewetlayerthickness is100to300µm.OncethecircuitboardisfullypopulatedwithMDcomponents,itisplacedinareflowenvironment,wherethepasteis heatedtoslightlyaboveitseutectictemperature.Whenthesolderpastereflows,theSMDcomponentsareattachedtothesolderpads. Solder Fluxes–solderfluxesaregenerallyappliedtopopulatedcircuitboardstocleanoxidesformingduringtheheatingprocessandto facilitatetheflowingofthesolder.Solderfluxescanbeeitherapartofthesolderpastecompoundorcanbeseparatematerials,usually fluids.Recommendedfluxesare: •non-activated(R)fluxes,wheneverpossible •mildlyactivated(RMA)fluxesofclassL3CN • class ORLO Activated (RA),watersolubleorstrongacidicfluxeswithachlorinecontent>0.2wt.%areNOTRECOMMENDED.Theuseofsuchfluxes could create high leakage current paths along the body of the varistor components. Whenafluxisappliedpriortowavesoldering,itisimportanttocompletelydryanyresidualfluxsolventspriortothesolderingprocess. Thermal Shock – to avoid the possibility of generating stresses in the varistor chip due to thermal shock, a preheat stage to within 100 °Cofthepeaksolderingprocesstemperatureisrecommended.Additionally,SMDvaristorsshouldnotbesubjectedtoatemperature gradientgreaterthan4°C/sec.,withanidealgradientbeing2°C/sec.Peaktemperaturesshouldbecontrolled.WaveandReflow solderingconditionsforSMDvaristorswithPb-containingsoldersareshowninFig.1and2respectively,whileWaveandReflowsoldering conditions for SMD varistors with Pb-free solders are shown in Fig, 1 and 3 |
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