Outline Dimensions

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Vishay Semiconductors

Revision: 08-Jul-15

1

Document Number: 95046

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

DIMENSIONS in millimeters and inches

Notes

the outmost extremes of the plastic body

SYMBOL

MILLIMETERS

INCHES

NOTES

SYMBOL

MILLIMETERS

INCHES

NOTES

MIN.

MAX.

MIN.

MAX.

MIN.

MAX.

MIN.

MAX.

A

4.06

4.83

0.160

0.190

D1

6.86

8.00

0.270

0.315

3

A1

0.00

0.254

0.000

0.010

E

9.65

10.67

0.380

0.420

2, 3

b

0.51

0.99

0.020

0.039

E1

7.90

8.80

0.311

0.346

3

b1

0.51

0.89

0.020

0.035

4

e

2.54 BSC

0.100 BSC

b2

1.14

1.78

0.045

0.070

H

14.61

15.88

0.575

0.625

b3

1.14

1.73

0.045

0.068

4

L

1.78

2.79

0.070

0.110

c

0.38

0.74

0.015

0.029

L1

-

1.65

-

0.066

3

c1

0.38

0.58

0.015

0.023

4

L2

1.27

1.78

0.050

0.070

c2

1.14

1.65

0.045

0.065

L3

0.25 BSC

0.010 BSC

D

8.51

9.65

0.335

0.380

2

L4

4.78

5.28

0.188

0.208

c

B

Detail A

c2

A

A

A

± 0.004

B

M

A

Lead tip

(3)

(3)

View A - A

(E)

(D1)

E1

B

H

A1

Detail “A”

Rotated 90 °CW

Scale: 8:1

L

Gauge

plane

0° to 8°

L3

L4

Seating

plane

Section B - B and C - C

Scale: None

(4)

(4)

(b, b2)

b1, b3

(c)

c1

Base

Metal

Plating

Conforms to JEDEC

13

2

D

C

A

L2

E

(2)(3)

(2)

4

H

BB

2 x b

2 x b2

L1

0.010

A

B

M

M

(3)

e

2 x

Pad layout

MIN.

11.00

(0.43)

MIN.

9.65

(0.38)

MIN.

3.81

(0.15)

MIN.

2.32

(0.08)

17.90 (0.70)

15.00 (0.625)

2.64 (0.103)

2.41 (0.096)