Status: Released

Drawing: Meghann Fedde

Scale: 2:1

Rev: H

Date: 8/20/01

File: SG-BGA-6016 Dwg

SG-BGA-6016 Drawing

© 2009 IRONWOOD ELECTRONICS, INC.

11351 Rupp Drive, Suite 400, Burnsville, MN 55337

Tele: (952) 229-8200

www.ironwoodelectronics.com

Modified: 7/16/09, AE

PAGE 2 of 4

Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise.

Recommended PCB Layout

Top View

Target PCB Recommendations

Total thickness: 2.4mm min.

Plating: Gold or Solder finish

PCB Pad height: Same or higher than solder mask

NOTE: Steel backing plate may be required based on end user's application

*Note: BGA pattern is not symmetrical

with respect to the mounting holes.

Non plated mounting hole

Non plated alignment hole

Orientation Mark

1.25mm±0.13mm (x4)

1.25mm±0.13mm (x4)

47.725mm±0.125mm(x4)

5.08mm

22.6125mm (x8)

1.27mm typ.

2.54mm

Ø 1.61mm±0.05mm (x8)

Ø 0.635mmxPAD

2.67mm*

Socket size

2.29mm

50.225mm±0.125mm (x4)

2.5mm±0.13mm

2.5mm±0.13mm

Backing plate size

Ø 0.85mm±0.025mm (x2)