181 CPL

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Vishay BCcomponents

Revision: 15-Jul-16

4

Document Number: 28417

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Table 3

ADVANCED SOLDERING PROFILE FOR LEAD (Pb)-FREE REFLOW PROCESS

Fig. 4 - Maximum temperature load during reflow soldering

Table 4

Note

• Temperature measuring point on top of the case and on terminals.

RECOMMENDED SOLDERING PAD DIMENSIONS in millimeters

CASE CODE

a

b

c

0606

1.9

3.5

1.6

0807

3.0

3.5

2.5

0812

3.0

3.5

2.5

1008

4.0

4.0

2.5

1013

4.0

4.0

2.5

REFLOW SOLDERING CONDITIONS for MAL2181xxxxxE3

PROFILE FEATURES

CASE CODE

0606 TO 1013

300 s

Max. ramp-up rate to 150 °C

3 K/s

150 s

110 s

0.5 K/s to 3 K/s

70 s

260 °C

40 s

3 K/s to 6 K/s

t

1

200

190

150

25

217

230

T

Peak

time (s)

T (°C)

t

2

t

3

t

4