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R46KN347000P1M Datasheet(PDF) 8 Page - Kemet Corporation

Part # R46KN347000P1M
Description  R46 (Miniature) Series, Class X2, 275 VAC
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Manufacturer  KEMET [Kemet Corporation]
Direct Link  http://www.kemet.com
Logo KEMET - Kemet Corporation

R46KN347000P1M Datasheet(HTML) 8 Page - Kemet Corporation

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© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
F3094_R46_X2_275_110C_MIN • 6/9/2016
8
Metallized Polypropylene Film EMI Suppression Capacitors
R46 (Miniature) Series, Class X2, 275 VAC, 110ºC
Manual Soldering Recommendations
Following is the recommendation for manual
soldering with a soldering iron.
The soldering iron tip temperature should be set
at350°C(+10°Cmaximum)withthesoldering
duration not to exceed more than 3 seconds.
Recommended Soldering Temperature
0
50
100
150
200
250
300
350
400
0
1
2
3
4
5
6
7
8
Soldering time (sec)
Soldering Process
The implementation of the RoHS directive has resulted in the selection of SnAgCu (SAC) alloys or SnCu alloys as primary solder. This has
increased the liquidus temperature from that of 183ºC for SnPb eutectic alloy to 217 – 221ºC for the new alloys. As a result, the heat stress
to the components, even in wave soldering, has increased considerably due to higher pre-heat and wave temperatures. Polypropylene
capacitors are especially sensitive to heat (the melting point of polypropylene is 160 – 170ºC). Wave soldering can be destructive, especially
for mechanically small polypropylene capacitors (with lead spacing of 5 mm to 15 mm), and great care has to be taken during soldering. The
recommendedsolderprofilesfromKEMETshouldbeused.PleaseconsultKEMETwithanyquestions.Ingeneral,thewavesolderingcurve
from IEC Publication 61760-1 Edition 2 serves as a solid guideline for successful soldering. Please see Figure 1.
Reflowsolderingisnotrecommendedforthrough-holefilmcapacitors.Exposingcapacitorstoasolderingprofileinexcessoftheabovethe
recommended limits may result to degradation or permanent damage to the capacitors.
Do not place the polypropylene capacitor through an adhesive curing oven to cure resin for surface mount components. Insert through-
holepartsafterthecuringofsurfacemountparts.ConsultKEMETtodiscusstheactualtemperatureprofileintheoven,ifthrough-hole
components must pass through the adhesive curing process. A maximum two soldering cycles is recommended. Please allow time for the
capacitor surface temperature to return to a normal temperature before the second soldering cycle.
Wave Soldering Recommendations
0
50
100
150
200
250
300
0
40
80
120
160
200
240
Time (s)
ca 2°C/s
ca 3.5°C/s typical
ca 5°C/s
Cooling
2+3s max
115°C max
Tpreheat
ΔT <150°C
100°C
Preheating
Typical
First wave
Second wave
260°C


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