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TPS65185RSLR Datasheet(PDF) 5 Page - Texas Instruments |
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TPS65185RSLR Datasheet(HTML) 5 Page - Texas Instruments |
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5 / 61 page  5 TPS65185, TPS651851 www.ti.com SLVSAQ8E – FEBRUARY 2011 – REVISED FEBRUARY 2017 Product Folder Links: TPS65185 TPS651851 Submit Documentation Feedback Copyright © 2011–2017, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network ground terminal. (3) It is recommended that copper plane in proper size on board be in contact with die thermal pad to dissipate heat efficiently. Thermal pad is electrically connected to PBKG, which is supposed to be tied to the output of buck-boost converter. Thus wide copper trace in the buck-boost output will help heat dissipated efficiently. 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT Input voltage at VIN(2), VIN_P, VIN3P3 –0.3 7 V Ground pins to system ground –0.3 0.3 V Voltage at SDA, SCL, WAKEUP, PWRUP, VCOM_CTRL, VDDH_FB, VEE_FB, PWR_GOOD, nINT –0.3 3.6 V Voltage on VB, VB_SW, VPOS_IN, VPOS_DIS, VDDH_IN –0.3 20 V VDDH_DIS –0.3 30 V Voltage on VN, VEE_IN, VCOM_PWR, VNEG_DIS, VNEG_IN –20 0.3 V Voltage from VIN_P to VN_SW –0.3 30 V Voltage on VCOM_DIS –5 0.3 V VEE_DIS –30 0.3 V Peak output current Internally limited mA Continuous total power dissipation 2 W TJ Operating junction temperature –10 125 °C TA Operating ambient temperature(3) –10 85 °C Tstg Storage temperature –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Input voltage at VIN, VIN_P, VIN3P3 3 3.7 6 V Voltage at SDA, SCL, WAKEUP, PWRUP, VCOM_CTRL, VDDH_FB, VEE_FB, PWR_GOOD, nINT 0 3.6 V TA Operating ambient temperature –10 85 °C TJ Operating junction temperature –10 125 °C |
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