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R475N21000001K Datasheet(PDF) 8 Page - Kemet Corporation

Part # R475N21000001K
Description  R47 Series, Class X2, 520 VAC (Automotive Grade)
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Manufacturer  KEMET [Kemet Corporation]
Direct Link  http://www.kemet.com
Logo KEMET - Kemet Corporation

R475N21000001K Datasheet(HTML) 8 Page - Kemet Corporation

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© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
F3008_R47_X2_520 • 6/9/2016
8
Metallized Polypropylene Film EMI Suppression Capacitors
R47 Series, Class X2, 520 VAC, 85ºC (Automotive Grade)
Manual Soldering Recommendations
Following is the recommendation for manual
soldering with a soldering iron.
The soldering iron tip temperature should be set
at350°C(+10°Cmaximum)withthesoldering
duration not to exceed more than 3 seconds.
Recommended Soldering Temperature
0
50
100
150
200
250
300
350
400
0
1
2
3
4
5
6
7
8
Soldering time (sec)
Soldering Process
The implementation of the RoHS directive has resulted in the selection of SnAgCu (SAC) alloys or SnCu alloys as primary solder. This has
increasedtheliquidustemperaturefromthatof183ºCforSnPbeutecticalloyto217–221ºCforthenewalloys.Asaresult,theheatstress
to the components, even in wave soldering, has increased considerably due to higher pre-heat and wave temperatures. Polypropylene
capacitorsareespeciallysensitivetoheat(themeltingpointofpolypropyleneis160–170ºC).Wavesolderingcanbedestructive,especially
for mechanically small polypropylene capacitors (with lead spacing of 5 mm to 15 mm), and great care has to be taken during soldering. The
recommendedsolderprofilesfromKEMETshouldbeused.PleaseconsultKEMETwithanyquestions.Ingeneral,thewavesolderingcurve
from IEC Publication 61760-1 Edition 2 serves as a solid guideline for successful soldering. Please see Figure 1.
Reflowsolderingisnotrecommendedforthrough-holefilmcapacitors.Exposingcapacitorstoasolderingprofileinexcessoftheabovethe
recommended limits may result to degradation or permanent damage to the capacitors.
Do not place the polypropylene capacitor through an adhesive curing oven to cure resin for surface mount components. Insert through-
holepartsafterthecuringofsurfacemountparts.ConsultKEMETtodiscusstheactualtemperatureprofileintheoven,ifthrough-hole
components must pass through the adhesive curing process. A maximum two soldering cycles is recommended. Please allow time for the
capacitor surface temperature to return to a normal temperature before the second soldering cycle.
Dielectric
Film Material
Maximum Preheat
Temperature
Maximum
Peak Soldering
Temperature
Capacitor
Pitch
≤10mm
Capacitor
Pitch
= 15 mm
Capacitor
Pitch
> 15 mm
Capacitor
Pitch
≤15mm
Capacitor
Pitch
> 15 mm
Polyester
130°C
130°C
130°C
270°C
270°C
Polypropylene
100°C
110°C
130°C
260°C
270°C
Polyphenylene
Sulphide
150°C
150°C
160°C
270°C
270°C
Wave Soldering Recommendations
Figure 1
0
50
100
150
200
250
300
0
40
80
120
160
200
240
Time (s)
ca 2°C/s
ca 3.5°C/s typical
ca 5°C/s
Cooling
2+3s max
115°C max
Tpreheat
ΔT <150°C
100°C
Preheating
Typical
First wave
Second wave
260°C


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