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RC0603JK-079K76L Datasheet(PDF) 9 Page - YAGEO Corporation

Part # RC0603JK-079K76L
Description  GENERAL PURPOSE CHIP RESISTORS
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Manufacturer  YAGEO [YAGEO Corporation]
Direct Link  http://www.yageo.com
Logo YAGEO - YAGEO Corporation

RC0603JK-079K76L Datasheet(HTML) 9 Page - YAGEO Corporation

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Chip Resistor Surface Mount
www.yageo.com
Feb. 17, 2017 V.5
Product specification
9
10
SERIES
RC_L
0075 to 2512
Thermal
Shock
MIL-STD-202 Method 107G
-55/+125°C
Note Number of cycles required is 300.
Devices mounted
Maximum transfer time is 20 seconds.
Dwell time is 15 minutes. Air - Air
0075/01005: ± (1% +50mΩ)
< 50mΩf or
jumper
Others:
± (0.5%+50mΩ) for B/D/F tol
± (1%+50mΩ) for J tol
<50mR for jumper
Short Time
Overload
IEC 60115-1 4.13
2.5 times RCWV or maximum overload voltage
which is less for 5 seconds at room temperature
0075/01005: ± (2% +50mΩ)
< 50mΩf or
jumper
Others:
± (1%+50mΩ) for B/D/F tol
± (2%+50mΩ) for J tol
<50mR for jumper
No visible damage
Board Flex/
Bending
IEC 60115-1 4.33
Device mounted or as described only 1 board
bending required
bending time: 60± 5 seconds
0075/0100/0201/0402:5mm;
0603/0805:3mm;
1206 and above:2mm
0075/01005: ± (1% +50mΩ)
< 50mΩf or
jumper
Others:
± (1%+50mΩ) for B/D/F/J Tol
<50mR for jumper
No visible damage
Solderability
- Wetting
J-STD-002 test B
Electrical Test not required Magnification 50X
SMD conditions:
1st step: method B, aging 4 hours at 155 °C
dry heat
2nd step: leadfree solder bath at 245± 3 °C
Dipping time: 3± 0.5 seconds
W ell tinned
(>95% covered)
No visible damage
-Leaching
J-STD-002 test D
Leadfree solder ,260°C, 30 seconds immersion
time
No visible damage
-Resistance to
Soldering Heat
MIL-STD-202 Method 210F
IEC 60115-1 4.18
Condition B, no pre-heat of samples
Leadfree solder, 260 °C ± 5°C, 10 ± 1 seconds
immersion time
Procedure 2 for SMD: devices fluxed and
cleaned with isopropanol
0075: ± (3%+50mΩ)
<50mΩ for jumper
01005: ± (1% +50mΩ)
< 50mΩf or jumper
Others:
±(0.5% +50mΩ ) for B/D/F
tol.±(1% +50mΩ ) for J tol.
<50mR for jumper
No visible damage


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